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1 FeaturesHigh-performance static CMOS technology up to 300MHz (3.33ns cycle time) 11v/1.2v core, 33v i/o、1.8V PLL Oscillator Design High-performance 32-bit CPU (TMS320C28X) IEEE-754 Single-Precision Floating-Point Unit (FPU) 16 16 and 32 32 MAC Operations 16 16 Dual Mac Harvard Bus Architecture Rapid interrupt response and handling Efficient** (using C C++ and assembly language) 6-channel DMA controller (for MCBSP, XINTF, and SARAM) 16-bit or 32-bit external interface (XINTF) Address coverage over 2m 16 on-chip memory up to 258k 16 saram 8k 16 boot ROM Clock and system control On-chip oscillator Watchdog timer module Peripheral interrupt extension (PIE) block to support all 64 peripheral interrupts Endian: little-endian Enhanced Control Peripherals Eighteen Enhanced Pulse Width Modulator (EPWM) Outputs Dedicated 16-bit timebase counter with period and frequency control Single-edge, symmetrical double-edge, or asymmetrical double-edged output Dead band generation Pulse-width modulation (PWM) chopping of high-frequency carriers with up to 9 trigger zone inputs at VDD=11v（1.65ps at 2V) HRPWM output with 55ps MEP resolution 6 x 32-bit Enhanced Capture (ECAP) modules Configurable as 3 capture inputs or 3 auxiliary PWM outputs Single pulse capture with up to 4 event timestamps 3 x 32-bit quadrature coded pulse (QEP) modules 6 x 32-bit timers and 9 x 16-bit timers Three 32-bit CPU timers Serial Port Peripherals Up to 2 CAN Modules Up to 3 SCIs (UART) Modules Up to 2 MCBSP Modules (configurable for SPI) Up to 2 SPI Modules 1 internal integrated circuit (I2C) bus External ADC Interface Up to 88 individually programmable multiplexed GPIO pins with input filtering Advanced** features Analysis and breakpoint capabilities Real-time debugging with hardware Package Options: 256-Ball Plastic Ball Grid Array (BGA) (ZFE) 179-Ball Microstar BGA (ZH) Temperature Options: t: 40°C to 105°C (ZFE, ZH) S: 40°C to 125°C (ZFE) Q: 40°C to 125°C (ZFE) (AEC Q100 qualified for automotive applications).
Part Number: Package: Package Size: TMS320C28346ZFE BGA (256) 170mm × 17.0mmtms320c28345zfe bga (256) 17.0mm × 17.0mmtms320c28344zfe bga (256) 17.0mm × 17.0mmtms320c28343zfe bga (256) 17.0mm × 17.0mmtms320c28342zfe bga (256) 17.0mm × 17.0mmtms320c28341zfe bga (256) 17.0mm × 17.0mmtms320c28346zep bga (256) 17.0mm × 17.0mmtms320c28345zep bga (256) 17.0mm × 17.0mmtms320c28344zep bga (256) 17.0mm × 17.0mmtms320c28343zep bga (256) 17.0mm × 17.0mmtms320c28342zep bga (256) 17.0mm × 17.0mmtms320c28341zep bga (256) 17.0mm × 17.0mmtms320c28345zhh bga microstar (179) 12.0mm × 12.0mmtms320c28343zhh bga microstar (179) 12.0mm × 12.0mmtms320c28341zhh bga microstar (179) 12.0mm × 12.0mm
2 ApplicationsIndustrial AC Inverter Drives Industrial Servo Amplifiers & Controllers Computer Numerical Control (CNC) Machinery Uninterruptible power supplies and server power supplies Telecom Equipment Power Supplies Photovoltaic inverters.
3 InstructionsThe TMS320C2834X (C2834X) Delfino microcontroller unit (MCU) device is based on TI's existing F2833x high-performance floating-point microcontrollers. The C2834X offers up to 300MHz floating-point performance and has up to 516KB of on-chip RAM. Designed for real-time control applications, the C2834X is based on the C28X core, making it compatible with all C28X microcontrollers. The C2834x's on-chip peripherals and low-latency cores make it an excellent solution for real-time control applications that require the highest performance requirements. The TMS320C28346, TMS320C28345, TMS320C28344, TMS320C28343, TMS320C28342, and TMS320C28341 devices are all part of the Delfino MCU family of highly integrated, high-performance solutions for demanding control applications.