At the IEDM conference, TSMC laid out plans to provide a one-trillion transistor chip package, very similar to the plan revealed by Intel last year. These big plans will benefit from a collection of small chips in 3D on a single chip package, but TSMC is also working to develop chips with 200 billion transistors on a single piece of silicon.
TSMC at the IEDM conference ** the advancement of packaging technology. To achieve this, the company reiterated that it will develop 2nm-class N2 and N2P production nodes by 2030 as well as 14nm-class A14 and 1nm-class A10 manufacturing processes.
In addition, TSMC expects advancements in packaging technology (CODOS, INFO, SOIC, etc.) to enable it to build large-scale multi-chip solutions that package more than one trillion transistors around 2030.
In recent years, the development of cutting-edge process technologies has slowed down due to technical and financial challenges faced by chipmakers. Like other companies, TSMC faces the same challenges, but the world's largest wafer foundry is confident that with the launch of TSMC 2nm, 14nm and 1nm wafers, which will be able to ramp up their production nodes in terms of performance, power consumption, and transistor density over the next five to six years.
Nvidia's 80 billion transistors GH100 is one of the most complex monolithic processors on the market, and according to TSMC, there will soon be more complex monolithic chips with more than 100 billion transistors. But manufacturing processors of this magnitude is becoming increasingly complex and expensive, so many companies opt for multi-chip designs. For example, AMD's Instinct Mi300X and Intel's Ponte Vecchio are made up of dozens of chiplets.
According to TSMC, this trend will continue, and in a few years we will see multi-chip solutions consisting of more than a trillion transistors. But at the same time, monolithic chips will continue to become more and more complex, and according to a TSMC report on the IEDM, we will see monolithic processors with up to 200 billion transistors.
TSMC and its customers must simultaneously develop logic and packaging technologies, with the former supporting the latter with density improvements, which is why the company includes the development of both production nodes and packaging technology in the same program.
If TSMC's ambitions succeed, the impact will be enormous:
Exascale calculations:The trillion transistor chips will usher in the era of exascale calculations, where machines can perform 10 to 18 calculations per second, enabling incredible advances in artificial intelligence, drug discovery, and scientific simulations.
Customized Medical:Imagine a medical device powered by chips that can analyze real-time patient data with unparalleled accuracy, paving the way for customized personalized and preventative care.
Autonomous driving:From self-driving cars to intelligent robots, trillions of transistor chips are likely to drive a new wave of autonomous systems that seamlessly interact with our environment.
Written in the last words:Technology is productivity, and TSMC's packaging roadmap is a glimpse into the future of computing, where the lines between chips and science are blurred. Despite the challenges, the potential rewards are immeasurable. The race for one trillion transistors has begun, and as TSMC technology advances, we can expect a journey full of technological breakthroughs and transformative innovations and excitement.
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