IT Home News on December 21, recently, Samsung announced that it will invest up to 40 billion yen in Japan in the next five years (IT Home Note: currently about 19RMB 9.2 billion) for the construction of an advanced chip R&D facility in Yokohama, Kanagawa Prefecture, Japan.
It is reported that the R&D facility will focus on the research of cutting-edge chip packaging technology. As early as March this year, Samsung expressed its intention to build a chip packaging factory in Kanagawa to strengthen cooperation with Japanese chip equipment and materials manufacturers. Samsung already has R&D centers in the region, and the investment will further deepen its ties with the Japanese tech community. It is worth mentioning that Japan** also plans to provide up to 20 billion yen (currently about 9.).9.6 billion yuan) to reinvigorate the country's chip R&D and manufacturing ecosystem.
The move comes at a time when the chip game between China, the United States and Japan is becoming increasingly fierce, and Samsung has been vigorously upgrading its chip packaging technology since last year in order to gain a competitive advantage in this key link. Chip packaging refers to the packaging of multiple components on a single chip, resulting in smaller size and higher energy efficiency.
Currently, Samsung is the world's second-largest semiconductor chip maker, but its foundry market share is much lower than that of its rival TSMC. The company plans to invest $230 billion over the next few years to overtake TSMC as the world's largest chipmaker.