If you don't blow it or black, the lithography machine will not be able to save China's semiconductors by breaking through 28nm, and the industry dilemma needs to be solved
According to the nomenclature, there are only EUV lithography machines and DUV lithography machines, of which DUV is divided into ARFI immersion lithography machines, ARF dry lithography machines, KRF lithography machines, I-line lithography machines, and G-line lithography machines.
These lithography technologies correspond to different processes, and there are no lithography technologies such as 90nm, 28nm, and 7nm in the industry.
But some time ago, there was always news that the domestic 28nm lithography machine was coming, so I couldn't figure out which kind of 28nm lithography machine it belonged toI think it must be one of the immersion lithography machines, why is it 28 nanometers?Does this 28nm refer to the highest process of 28nm, or does it refer to the resolution?
If you're referring to the highest process, then the 28 nm coming out of the immersion lithography machine shouldn't be the highest 7 nm, while the average ARF dry method is the highest overall 65 nm?
So, if you're referring to resolution, as you can see in the image below, ASML's NXT:1980DI immersion lithography has a resolution of 38 nanometers, but can produce 7 nanometer chips, then isn't this 28 nanometer resolution more advanced?
So I'm a little confused, confused about this 28nm lithography technology, what the hell is going on.
In addition, it is worth mentioning that many people always feel that with this lithography machine, domestic chips will be saved, and they will no longer be afraid of being stifled, I think this is also debatable, in my opinion, just the progress of lithography machine can not save China's semiconductors.
To manufacture chips, hundreds of pieces of semiconductor equipment are needed, and the lithography machine is only one of the main equipment on the production line, and the domestic substitution of other equipment is equally important.
This is a network diagram showing the gap between the current international advanced level and the domestic advanced level of several key equipment.
We know at a glance that the current key equipment of the country is almost 14 nanometers, the lithography machine is 90 nanometers, and the non-public is 28 nanometers, and there is still a short distance in the middle.
In addition to these devices, dozens or hundreds of materials are also needed in the chip manufacturing process, such as photoresists, targets, special gases, etc., some of which can only be manufactured in Japan, such as EUV photoresists.
You see, isn't this the lithography process?It's a combination of many things that are just as important as the photoresist material, and the photoresist material is just one part of it.
To be honest, at present, if the US imperialists only rely on their own efforts, they will not be able to come up with 14-nanometer chips, and they must integrate the global ** chain.
It is not only necessary to invest in semiconductor equipment and material enterprises, but also to find ways to make downstream enterprises have the motivation to use domestic wafers, so that wafer enterprises have the motivation to buy domestic equipment and materials.