Huawei, as a leader in China's electronics industry, has recently made remarkable breakthroughs in the field of chips. In addition to the high-profile research and development of Kirin 9000s chips, Huawei also announced a series of patent information, further demonstrating its deep strength in the chip field.
Among them, a patent on wafer fabrication has attracted widespread attention. The patent is titled "Wafer Handling Device and Wafer Processing Method", the application date is June 2, 2022, the application publication date is December 12, 2023, and the application publication number is CN117219552A.
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The main content of the patent is about a wafer handling device and its processing method. The device consists of a wafer carrier, which can be rotated along an axis of rotation. The robotic arm consists of a robotic arm that handles the wafer and places it on the wafer stage. The controller coordinates the work of the various parts, while the calibration assembly consists of a raster plate, light source, and an imaging element.
Specifically, the controller controls the robotic arm or the adjustment device on the robotic arm based on the detection of the light received by the imaging element to adjust the position of the wafer. When the wafer carrier carries the wafer, the grating plate and the imaging element are located on opposite sides of the plane on the upper surface of the wafer carrier. This design improves wafer alignment efficiency and accuracy.
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Although Huawei has suffered external repression in recent years, this has not stopped its exploration and development in the field of scientific research. The number of Huawei's patents has been rising, demonstrating its strong strength in technological innovation.
Looking ahead, we have reason to expect Huawei to continue to make more innovations and breakthroughs in the field of chips. Through continuous efforts and innovation, Huawei will contribute more to China's technological development and promote the development of the entire industry.