According to reports, South Korea's Samsung Electronics plans to invest about 40 billion yen (about 2.) in the next five yearsUS$800 million) to establish an advanced chip packaging research facility in Japan. It was previously reported that Samsung is considering building a packaging factory in Kanagawa Prefecture, Japan, to deepen ties with Japanese manufacturers of wafer manufacturing equipment and materials.
The report quoted a statement from the Japanese Ministry of Industry as saying that Samsung will be provided with subsidies of up to 20 billion yen to support this plan and promote the revival of Japan's domestic semiconductor manufacturing industry. Samsung's investment comes after tensions between South Korea and Japan eased, and the two countries further collaborated as the United States encouraged allies to work together to counter China's growing technological prowess.
Since 2022, South Korea's Samsung has been stepping up its investment in its advanced wafer packaging division. The company is racing to develop advanced packaging technologies that combine individual components into a single package to improve overall chip performance.
In response, Kyung Kye-Hyun, head of Samsung's semiconductor business, said in the announcement that the expected construction of the factory in Japan will allow Samsung to strengthen its leadership position in the semiconductor field and further cooperate with the Yokohama-based packaging R&D unit.