The global semiconductor equipment market size from 2013 to 2022 was determined by 317$900 million to $1,085$0.0 billion, with an average annual growth rate of 1461%, and the size of the Chinese market increased from 340 billion US dollars grew to 329$4.8 billion, with an average annual growth rate of 2870%, China's semiconductor equipment market accounted for 3034%。
Among them, 2021 is a key year for the semiconductor industry to accelerate the expansion of investment and production capacity, and the global semiconductor equipment market growth rate is as high as 4410%, an increase of 25 from 202004 percentage points, the growth rate of the domestic market is as high as 5823%, up from 38 in 202067% improvement of 1956 percentage points.
Due to the rebound in the prosperity of the semiconductor industry and the acceleration of the expansion progress of downstream packaging and testing manufacturers, the global packaging equipment market has achieved significant year-on-year growth, with an average annual compound growth rate of 57 from 2019 to 202157%。According to SEMI, the global packaging equipment market will reach $7.8 billion in 2022, a year-on-year increase of 833%, the packaging equipment market size is expected to reach $7.7 billion in 2023, basically the same as in 2022.
InWire bonding equipmentAt the level, according to SEMI research statistics, in the whole life cycle process of semiconductor front-end and back-end processes, packaging equipment accounts for about 6% of the semiconductor equipment market size, of which wire bonding machines account for 32% of the packaging equipment market size. According to this calculation, the proportion of wire bonding machines in the semiconductor process equipment market size is 192% of the global wire bonder market size increased from 70.1 billion dollars grew to 20. in 2022$8.3 billion, with an average annual growth rate of 1683%, and the global wire bonder market size is expected to grow to 23$1.9 billion.
At the level of domestic wire bonders, the market is basically occupied by international leading manufacturers such as K&S and ASMPT, and imports account for a relatively large proportion before 2021, and the overall market size is equivalent to the import amount.
According to China Customs statistics, in 2021, China's imported wire bonding equipment grew rapidly to 31,132 units, a year-on-year increase of 9349%；The import value amounted to 15$8.5 billion, up 13.6 billion year-over-year92%, a record high. With the gradual maturity of domestic wire bonder technology, the trend of domestic substitution is obvious, and the number of wire bonding machines imported in China will drop to 13,899 units in 2022, close to the number of imports in 2017, down 55% year-on-year35%；Import Value 9$200 million, down 4.1 billion year-on-year97%, the unit price of imported equipment continued to rise.
Since 2018, with the decoupling of science and technology between China and the United States, key technologies and equipment".Stuck neck"" cut off supply"The risk continues to increase, and the localization process of equipment oriented to maintaining the security of the first chain is accelerating. Since 2021, in the semiconductor packaging and testing sector, the supply of domestic equipment has been continuously pulled upwards through the vigorous increase in production capacity of semiconductor packaging and testing manufacturers, and the market pattern of wire bonding machines has gradually tilted towards domestic manufacturers.
Chapter 1 Overview of the wire bonder industry
Section 1 Definition of wire bonder industry.
Section 2 Classification of main products in the wire bonding machine industry.
1. Manual wire bonding machine.
2. Semi-automatic wire bonding machine.
3. Automatic wire bonding machine.
Section 3 Introduction to research institutions in the wire bonding machine industry.
Chapter 2 Overview of the market characteristics of the wire bonding machine industry
Section 1 Industry Market Overview.
First, the characteristics of the industry market.
Second, the degree of marketization of the industry.
Third, the profit level and change trend of the industry.
Section 2 Main Obstacles to Entering the Industry.
1. Barriers to capital access.
2. Barriers to market access.
3. Technological and talent barriers.
Fourth, other obstacles.
Section 3 Cyclical and regional nature of the industry.
1. Industry cycle analysis.
1. The cyclical volatility of the industry.
2. Industry product life cycle.
Second, the regionality of the industry.
Section 4 Relevance of Industries and Upstream and Downstream Industries.
1. Overview of the industry chain.
Second, the distribution of upstream industries.
Third, the distribution of downstream industries.
Chapter 3 2019-2022 China Wire Bonder Industry Development Environment Analysis
Section 1 Political and legal environment of wire bonder industry (P).
1. Analysis of industry authorities.
2. Analysis of the industry regulatory system.
3. Main laws and regulations of the industry.
Fourth, the analysis of relevant industrial policies.
Fifth, the relevant development plan of the industry.
Section 2 Analysis of the economic environment of the wire bonder industry (e).
1. Analysis of the international macroeconomic situation.
2. Analysis of China's macroeconomic situation.
Section 3 Analysis of the social environment of the wire bonder industry (S).
Section 4 Analysis of the technical environment of the wire bonder industry (T).
1. Technical analysis of wire bonding machine.
Second, the technical development level of wire bonding machine.
Third, the main technology development trend of the industry.
Chapter 4 Overview of the development of the global wire bonder industry
Section 1 Overview of the development of the global wire bonder industry from 2019 to 2022.
First, the development status of the global wire bonding machine industry.
Second, the development characteristics of the global wire bonding machine industry.
Third, the market size of the global wire bonding machine industry.
Section 2 2019-2022 development status of wire bonding machine industry in major regions of the world.
1. Overview of the development of the European wire bonding machine industry.
Second, an overview of the development of the wire bonding machine industry in the United States.
3. Overview of the development of the wire welding machine industry in Japan and South Korea.
Section 3 2023-2028 Global Wire Bonder Industry Development Prospects**.
First, the global wire bonding machine industry market size.
2. Analysis of the development prospect of the global wire bonding machine industry.
3. Analysis of the development trend of the global wire bonding machine industry.
Section 4 Analysis of the development dynamics of key enterprises in the global wire bonding machine industry.
Chapter 5 Overview of the development of China's wire bonder industry
Section 1 Analysis of the development status of China's wire bonding machine industry.
First, the development stage of China's wire bonding machine industry.
Second, the overall development of China's wire bonding machine industry.
3. Analysis of the development characteristics of China's wire bonding machine industry.
Section 2 2019-2022 development status of wire bonder industry.
1. The market size of China's wire bonding machine industry from 2019 to 2022.
2. Analysis of the development of China's wire bonding machine industry from 2019 to 2022.
3. Analysis of the development of China's wire bonding machine enterprises from 2019 to 2022.
Section 3 The dilemmas and countermeasures faced by China's wire bonding machine industry from 2023 to 2028.
Chapter 6 Analysis of the market operation of China's wire bonder industry
Section 1 Analysis of the overall scale of China's wire bonding machine industry from 2019 to 2022.
1. Analysis of the number and structure of enterprises.
Second, the analysis of the size of the staff.
3. Analysis of the scale of industry assets.
Fourth, the industry market size analysis.
Section 2 Analysis of the production and sales of China's wire bonding machine industry from 2019 to 2022.
1. The total industrial output value of the industry to which China's wire bonding machine belongs.
Second, the industrial sales output value of China's wire bonding machine industry.
Third, the production and sales rate of China's wire bonding machine.
Section 3 2019-2022 China wire bonder industry market supply and demand analysis.
1. Supply analysis of the industry to which China's wire bonding machine belongs.
Second, the industry demand analysis of China's wire bonding machine.
Third, the supply and demand balance of the industry to which China's wire bonder belongs.
Section 4 Overall analysis of the financial indicators of China's wire bonding machine industry from 2019 to 2022.
1. Industry profitability analysis.
2. Analysis of the solvency of the industry.
3. Analysis of industry operating capabilities.
Fourth, the analysis of industry development capabilities.
Chapter 7 Market Analysis of China Wire Bonding Machine Industry Segments
First, the adequacy of market segmentation.
Second, the development trend of market segmentation.
3. Market segmentation strategy research.
Fourth, the analysis of market segment structure.
Section 1 Overview of the market segment of wire bonders in the field of integrated equipment manufacturers.
1. Overview of the current situation of market development.
Second, the industry market size analysis.
3. Analysis of industry market demand.
Fourth, the product market potential analysis.
Section 2 Overview of the market segment of wire bonders in the field of outsourced semiconductor assembly and test (OSAT).
1. Overview of the current situation of market development.
Second, the industry market size analysis.
3. Analysis of industry market demand.
Fourth, the product market potential analysis.
Chapter 8 Analysis of the upstream and downstream industrial chains of China's wire bonding machine industry
Section 1 Overview of the industrial chain of the wire bonding machine industry.
1. Definition of industrial chain.
Second, the wire bonding machine industry chain.
Section 2 Analysis of the development of the main upstream industries of the wire bonder industry.
First, the development status of upstream industries.
2. Analysis of upstream industry supply.
3. Analysis of upstream supply.
Fourth, the main supply enterprises analysis.
Section 3 Analysis of the development of the main downstream industries of the wire bonding machine industry.
First, the development status of downstream (application industry) industry.
2. Analysis of downstream (application industry) industry demand.
3. Analysis of the main demand enterprises in the downstream (application industry).
Fourth, the downstream (application industry) of the most promising products industry analysis.
Chapter 9 Analysis of the market competition pattern of China's wire bonder industry
Section 1 Analysis of the competitive landscape of China's wire bonding machine industry.
First, the regional distribution pattern of the wire bonding machine industry.
Second, the scale pattern of enterprises in the wire bonding machine industry.
Third, the nature of the wire bonding machine industry enterprise pattern.
Section 2 Analysis of the five forces of competition in China's wire bonding machine industry.
First, the upstream bargaining power of the wire bonding machine industry.
Second, the downstream bargaining power of the wire bonding machine industry.
Third, the threat of new entrants in the wire bonding machine industry.
Fourth, the threat of substitute products in the wire bonding machine industry.
Fifth, the existing enterprises in the wire bonding machine industry compete.
Section 3 SWOT analysis of competition in China's wire bonder industry.
1. Analysis of the advantages of the wire bonding machine industry (S).
2. Analysis of the disadvantages of the wire bonding machine industry (W).
3. Opportunity analysis of wire bonding machine industry (O).
Fourth, the threat analysis of the wire bonding machine industry (t).
Chapter 10 Analysis of the competitiveness of leading enterprises in China's wire bonding machine industry
Section 1 Analysis of Company A's Competitiveness.
First, the basic situation of development.
Second, the main product analysis.
3. Competitive advantage analysis.
Fourth, the analysis of business conditions.
Fifth, the latest developments.
6. Analysis of development strategy.
Section 1 Analysis of the Competitiveness of Company B.
First, the basic situation of development.
Second, the main product analysis.
3. Competitive advantage analysis.
Fourth, the analysis of business conditions.
Fifth, the latest developments.
6. Analysis of development strategy.
Section 1 Analysis of the competitiveness of Company C.
First, the basic situation of development.
Second, the main product analysis.
3. Competitive advantage analysis.
Fourth, the analysis of business conditions.
Fifth, the latest developments.
6. Analysis of development strategy.
Section 1 Analysis of Company D's Competitiveness.
First, the basic situation of development.
Second, the main product analysis.
3. Competitive advantage analysis.
Fourth, the analysis of business conditions.
Fifth, the latest developments.
6. Analysis of development strategy.
Section 1 Analysis of the competitiveness of Company E.
First, the basic situation of development.
Second, the main product analysis.
3. Competitive advantage analysis.
Fourth, the analysis of business conditions.
Fifth, the latest developments.
6. Analysis of development strategy.
Chapter 11 2023-2028 China Wire Bonder Industry Development Trend and Prospect Analysis
Section 1 2023-2028 China Wire Bonding Machine Market Development Prospects.
1. The development potential of the wire bonding machine market from 2023 to 2028.
2. Prospects for the development of the wire bonding machine market from 2023 to 2028.
3. Analysis of the development prospects of the wire bonding machine subdivision industry from 2023 to 2028.
Section 2 2023-2028 China Wire Bonding Machine Market Development Trend**.
1. The development trend of the wire bonder industry from 2023 to 2028.
2. The market size of wire bonding machines from 2023 to 2028**.
3. Application trend of wire bonding machine industry from 2023 to 2028**.
Section 3 Supply and demand of China's wire bonding machine industry from 2023 to 2028**.
1. 2023-2028 supply of China's wire bonding machine industry.
2. 2023-2028 China's wire bonding machine industry demand**.
3. 2023-2028 supply and demand balance of China's wire bonding machine**.
Section 4 Key Trends Affecting the Production and Operation of Enterprises.
1. Favorable and unfavorable factors for the development of the industry.
Second, the growth trend of market integration.
3. Changing demand trends and new business opportunities**.
Fourth, the trend of regional market expansion of enterprises.
5. Trends in scientific research and development and progress in alternative technologies.
Chapter 12 Investment Prospects of China's Wire Bonding Machine Industry from 2023 to 2028
Section 1 Analysis of the investment status of the wire bonding machine industry.
1. Analysis of the investment scale of the wire bonding machine industry.
Second, the composition of investment funds in the wire bonding machine industry.
3. Analysis of the use of investment funds in the wire bonding machine industry.
Section 2 Analysis of investment characteristics of wire bonding machine industry.
1. Analysis of entry barriers to the wire bonding machine industry.
Second, the analysis of the profit model of the wire bonding machine industry.
3. Analysis of profitability factors of wire bonding machine industry.
Section 3 Analysis of investment opportunities in the wire bonding machine industry.
1. Investment opportunities in the industrial chain.
Second, market segment investment opportunities.
3. Investment opportunities in key regions.
Fourth, the blank spot analysis of industrial development.
Section 4 Investment risk analysis of wire bonder industry.
First, the policy risk of the wire bonding machine industry.
2. Macroeconomic risks.
3. Market competition risk.
4. Risks of related industries.
5. Product structure risk.
6. Technology R&D risks.
7. Other investment risks.
Section 5 Investment potential and suggestions for wire bonding machine industry.
1. Analysis of the investment potential of the wire bonding machine industry.
Second, the latest investment trends in the wire bonding machine industry.
3. Investment opportunities and suggestions in the wire bonding machine industry.
Chapter 13 2023-2028 China Wire Bonder Enterprise Investment Strategy and Customer Strategy Analysis
Section 1 Background significance of the strategic planning of the development of wire bonding machine enterprises.
First, the need for enterprise transformation and upgrading.
Second, the need for enterprises to become bigger and stronger.
Third, the sustainable development needs of enterprises.
Section 2 Basis for formulating strategic planning of wire bonding machine enterprises.
1. National policy support.
Second, the law of industry development.
3. Enterprise resources and capabilities.
Fourth, predictable strategic positioning.
Section 3 Analysis of strategic planning strategy of wire bonding machine enterprises.
1. Comprehensive strategic planning.
Second, the technology development strategy.
3. Regional strategic planning.
Fourth, industrial strategic planning.
Fifth, marketing brand strategy.
6. Competitive strategic planning.
Section 4 Research on the development strategy of small and medium-sized enterprises of wire bonding machine.
Section 5 Implementation of the market's key customer strategy.
Chapter 14 Conclusions and Recommendations
Section 1 Conclusions.
Section 2 Recommendations.
1. Suggestions on industry development strategies.
2. Suggestions on the direction of industry investment.
3. Suggestions on industry investment methods.
Table of Contents of Charts
Chart: Characteristics of wire bonding machine industry.
Chart: Wire bonder industry life cycle.
Chart: Analysis of the industrial chain of the wire bonding machine industry.
Chart: 2019-2022 wire bonder industry market size analysis.
Chart: Market size of wire bonding machine industry from 2023 to 2028**.
Chart: Profitability analysis of the industry to which China's wire bonding machine belongs.
Chart: Analysis of the operational capability of the industry to which China's wire bonder belongs.
Chart: Analysis of the solvency of China's wire bonder industry.
Chart: Analysis of the development capacity of China's wire bonding machine industry.
Chart: Analysis of the operating benefits of the industry to which China's wire bonding machine belongs.
Chart: Comparison of important data indicators of wire bonders from 2019 to 2022.
Chart: 2019-2022 China wire bonding machine industry sales analysis.
Chart: Analysis of the profit of China's wire bonding machine industry from 2019 to 2022.
Chart: Analysis of the assets of the industry to which China's wire bonding machine belongs from 2019 to 2022.
Chart: 2019-2022 China Wire Bonder Competitiveness Analysis.
Chart: 2023-2028 China's wire bonder production capacity**.
Chart: China's Wire Bonder Consumption 2023-2028**.
Chart: 2023-2028 China Wire Bonder Market Prospect**.
Chart: 2023-2028 China wire bonding machine market **trend**.
Chart: 2023-2028 China Wire Bonder Development Prospect**.