TSMC is ambitious, and it will enter the 1nm era in 2030, can you believe it?
TSMC released a blueprint that shocked the industry at the 2023 IEEE International Electronic Components Conference, and they plan to achieve 1nm process technology by 2030. This means that they will develop chips containing up to 200 billion transistors. To achieve this, TSMC is developing 2nm-class N2 and N2P production nodes, 14nm-class A14 and 1nm-class A10 manufacturing processes.
At the same time, they will also promote the development of 3D packaging and single-chip packaging technology paths in parallel. It is expected that in 2025, TSMC will complete the N2 and N2P nodes, making the number of chip transistors in 3D packaging more than 500 billion, and the number of chip transistors in traditional packaging technology more than 100 billion. TSMC's plan is similar to Intel's, with both companies racing to advance process technology.
The competition between chip manufacturing giants is intensifying, and we look forward to more amazing technological breakthroughs in the future. What do you think of TSMC's plan?Feel free to leave a message in the comment area!2023 Post Sprint Competition