New Equipment: Chip Tester (for LD Chip);Manufacturer: Japan Manufacturer Introduction: This product is a device that automatically measures electrical characteristics, light output characteristics, FFP characteristics, wavelength characteristics, NFP characteristics, etc. by placing an LD chip diode diode on a measurement table. The PC displays the measurement results and the pass and fail judgments. This device is dedicated to LD Chip devices.
Target Devices and Applications:
Target device: LD bar device, (device size) Width: 150 m, cavity length: 150 m, thickness: 70 m
Equipment use: LD for LIDAR, LD for communication, LD for re-recording, LD for display, medical LD, LD for sensors, LD for processing
Features: Various storage formats (rings, trays, gel packs), non-destructive probes, high-speed positioning equipped with image processing, D**i engine visual inspection function, automatic probe adjustment function, proposal to combine the optimal optical system for multi-function devices, "direct measurement of pulse waveforms", detailed measurement near ITH and VTH, high-speed multi-point I-L, I-V measurement, high-speed cycle measurement (less than 2sec).
Main Specifications: Drive Specifications.
driver line up：current pulse width
1、cw driver (low)、~1a、cw
2、cw driver (high)、~5a、cw
3、standard pulse driver、~5a、50usec
4、high speed pulse driver (low)、~1a、2usec
5、high speed pulse driver (high)、~50a、2usec
6、high power pulse driver for lidar、~50a、50nsec
Measurement items: I-L measurement, SE measurement, RD measurement, I-V measurement, wavelength measurement, DC measurement (IR VR measurement), FFP measurement, NFP measurement.
List of mechanical components: equipment loader for product changeover Unloader, positioning mechanism flat blade, turning mechanism, temperature console for various products, low load low contact resistance probe & stage, highly serviceable probe (auto-initialization function), sorting mechanism.