Wave soldering is a common problem in wave soldering production. There are several reasons that may lead to tinning:
Flux problems: Insufficient flux activity, insufficient wettability, too little or uneven coating weight, etc.
Preheating temperature problem: If the preheating temperature is too high or too low, the flux activity will be low, and the wetting power and fluidity of the solder will be poor, resulting in tin stringing.
Flux use problems: No flux is used or the flux is used insufficiently or unevenly, resulting in the solder surface tension is not released, and it is easy to cause tin connection.
Temperature and soldering speed issues: even tin and tin pot temperature, preheating temperature and soldering speed and other parameters are also related.
Tin composition problem: Check the tin composition regularly, if the copper or other metal content exceeds the standard, the fluidity of the tin will be reduced, and tin will easily occur.
Solder purity problems: If the impurities in the solder exceed the standard, the solder characteristics will change, and the wetting or fluidity will deteriorate. Contains antimony more than 10%, arsenic more than 02%, interval more than 0At 15%, the fluidity of the solder will decrease by 25%. and arsenic content is less than 0005% will be dewetted.
Wave soldering equipment problems: The track angle of wave soldering, PCB board deformation, etc. may also affect the tinning.
It should be noted that there are many reasons for wave soldering over the furnace and tin, and the specific situation needs to be analyzed and treated. If the problem persists, it is recommended to contact a professional technician for service and maintenance.