Recently, a new patent of Huawei called "Wafer Handling Device and Wafer Processing Method" was published on Qichacha**. The patent has an application date of June 2, 2022, a publication date of December 12, 2023, and publication number CN117219552A. According to the patent abstract, the patent relates to a wafer handling device and a wafer handling method designed to improve wafer alignment efficiency and alignment accuracy. This is of great significance to the chip manufacturing industry.
In this patent, the wafer handling device consists of a wafer carrier, robotic arm, controller, and calibration assembly. The wafer carrier is capable of rotating along an axis of rotation, while the robotic arm is responsible for handling the wafer and placing it on the wafer carrier. The controller is used to detect the light emitted from the light source based on the imaging element and adjust the position of the wafer by controlling the robotic arm or adjustment device. In the case where the wafer stage is carrying the wafer, the grating plate and the imaging element are located on either side of the upper surface of the wafer stage and are used to provide the optical information required for alignment.
The main purpose of this patent is to improve the efficiency and precision of wafer alignment. Wafer alignment is a critical step in today's chip manufacturing world, which has a direct impact on the performance and quality of the chip. Therefore, through the application of this patented technology, Huawei is expected to make a major breakthrough in wafer alignment, bringing higher quality and efficiency to the chip manufacturing industry.
1. Improve wafer alignment efficiency
Wafer alignment is a crucial step in the chip manufacturing process. Patented technology of wafer handling devices and wafer handling methods can improve the efficiency of wafer alignment and reduce the waste of time and resources in production. Through more efficient wafer alignment, Huawei can increase the productivity and efficiency of chip manufacturing to meet the growing market demand.
2. Improve wafer alignment accuracy
Wafer alignment accuracy is one of the key indicators that affect the performance and quality of chips. Huawei's new patent improves the accuracy of wafer alignment by introducing the use of calibration components and optical information. This will help produce more stable and reliable chip products, improve user experience, and meet the needs of more application scenarios.
3. Promote the development of the chip manufacturing industry
As Huawei continues to increase R&D investment in the field of chip manufacturing, especially after being suppressed by the United States, Huawei attaches more importance to the research of chip manufacturing-related technologies. The successful application of this patent will further promote the development of China's chip manufacturing industry and improve the independent ability of domestic chip manufacturing. In the international market, Huawei's patented technology is also expected to become a benchmark and competitive advantage in China's chip manufacturing industry.
Huawei's new patent demonstrates its innovation capabilities and technical prowess in wafer handling devices and wafer handling methods. As a world-renowned supplier of communications equipment and smart terminals, Huawei has been committed to promoting technological progress and industry development. Through continuous R&D investment and innovation, Huawei continues to improve its core competitiveness in the field of chip manufacturing.
The patent's ** has a positive impact on the chip manufacturing industry. Wafer alignment is a crucial part of the chip manufacturing process, which is directly related to the quality and performance of the chip. By improving the efficiency and accuracy of wafer alignment, Huawei's patented technology is expected to help the industry reduce production costs, improve product quality, and promote the further development of the chip manufacturing industry.
In short, Huawei's new patent demonstrates Huawei's technical strength and innovation capabilities in the field of chip manufacturing. Through the application of patented technologies such as wafer handling devices and wafer processing methods, Huawei is expected to improve the efficiency and accuracy of wafer alignment and promote the development of the chip manufacturing industry. This is not only in line with Huawei's mission to promote technological progress and industry development, but also an important breakthrough and contribution to today's chip manufacturing industry. We look forward to the practical application of Huawei's patented technologies to bring more innovation and development opportunities to the industry."