In 2025, China's semiconductor equipment will be localized to 50%, and it will no longer rely on the United States
As we all know, the reason why the United States is strong in the field of chips and can suppress whoever it wants is because the United States has several trump cards in the field of chips.
First of all, in the field of EDA software, the United States accounts for more than 80% of the global share. Secondly, in the field of semiconductor equipment, the United States ** companies account for about 50% of the share;In addition, ASML also listens to the United States, and Japanese ** businessmen also listen to the United States.
In addition, most of the intellectual property rights in the chewing gum industry are also in the United States, coupled with the fact that the United States monopolizes about 50% of the world chewing gum market, so the United States enjoys chewing gum hegemony.
And Chinese mainland, because EDA, semiconductor equipment, intellectual property rights, etc., many are using American technology (products), so to some extent, the United States is stuck in the neck.
However, in recent years, due to well-known reasons, the national ** chain is also trying to move upward, in the field of EDA and equipment, especially in the field of semiconductor equipment, and the results are very gratifying.
For example, SEMI believes that by 2022, the localization rate of semiconductor equipment in Chinese mainland will reach about 30%, but by 2025, the localization rate will reach 50%, and initially get rid of dependence on US semiconductor equipment.
SEM believes that at present, in the field of 28 nanometers and above, Chinese semiconductor equipment manufacturers have basically achieved full coverage, and the localization rate has reached more than 80%. In the field of 14nm process, Chinese semiconductor equipment manufacturers have also achieved more than 50% coverage, and the localization rate may reach more than 20%. At present, the localization rate of the 14nm process is still very low, perhaps only about 10%.
However, in general, domestic semiconductor equipment in the fields of cleaning, CMP, etching, testing, and sorting machines has exceeded double digits, and the localization of deposition, ion implantation, probe stations and other fields has also made some progress.
In fact, if you count the bidding of the national wafer production line in 2022, you will find that the national semiconductor equipment manufacturers have won a total of 231 bids for equipment, with a winning rate of about 30%.
In the fields of PVD equipment and oxidation equipment, wet etching equipment, the proportion of national equipment exceeds 50%, and some even reach about 70%.
Previous data show that in 2019, the proportion of domestic semiconductor equipment was only 7About 5%, and now in just two years, the proportion of domestic semiconductor equipment has increased by about 30%, and the speed of development is really visible to the naked eye.
If the localization rate of semiconductor equipment reaches 50%, or even higher, and so on, I think China's integrated circuit industry will really develop and no longer rely so much on the United States.
Of course, our current shortcomings are advanced processes, especially 14nm and subsequent advanced processes, such as EUV lithography, etc., which have not yet been overcome, after all, the overall capacity of the chip depends on the shortest part of other equipment, there is a first-mover advantage, and this first-mover advantage will still be stuck if it is not overcome.