There are obvious differences between organic high-temperature adhesives and inorganic high-temperature adhesives in many aspects. Here are their main differences:
Ingredients: The main components of organic high-temperature adhesives include organic compounds such as silicone and epoxy, while the main components of inorganic high-temperature adhesives include inorganic compounds such as copper oxide, alumina, aluminosilicate, and water glass. Temperature resistance: Organic high-temperature adhesives can usually withstand temperatures ranging from 200 to 350, while inorganic high-temperature adhesives can withstand higher temperatures, usually around 1000. Adhesion performance: Organic high-temperature adhesive has good adhesion performance on metal, plastic and other materials, while inorganic high-temperature adhesive is more suitable for the bonding of inorganic materials such as refractory materials and ceramics. Applications: Organic high-temperature adhesives are widely used in automobiles, aerospace, electronics, machinery and other fields, while inorganic high-temperature adhesives are mainly used for bonding in the fields of ceramics, glass products, steel and non-ferrous metals.
Curing method: Organic high-temperature adhesives are usually cured by heating or pressurization, while inorganic high-temperature adhesives need to be cured in a wet environment. Cost: The cost of organic high-temperature adhesives is relatively low, while the cost of inorganic high-temperature adhesives is higher. In short, there are obvious differences between organic high-temperature adhesives and inorganic high-temperature adhesives in terms of composition, temperature resistance, adhesive performance, environmental performance, application fields, curing methods and costs. Choosing the right high-temperature glue needs to be selected on a case-by-case basis and the relevant instructions for use should be followed.