Introduction to FPC flexible circuit board lamination process

Mondo Technology Updated on 2024-01-31

Stacking, mold opening, feeding, mold closing, pre-pressing, molding, cooling, mold opening, blanking, inspection, and the next process.

a.Before production, prepare the release film, steel plate, and silicone, and clean the steel plate with a sticky dust cloth or sticky paper, and clean the steel plate with a sticky paper Silicone release film surface dust, debris, etc.

b.The size of the release film is opened (500m*500m), and it is placed in the stacking area for standby, and 400 pieces of steel plates need to be reserved for each stack after a cycle of flexible plates, so that the production will not be interrupted.

c.When stacking operation, it is necessary to wear gloves with both hands or finger covers with 5 fingers, and it is strictly forbidden to touch the soft board with bare hands.

d.When stacking the plates, put the steel plate silicone release film FPC release film silicone steel plate first. Has been according to this stack of 10 layers (except for special requirements), the number of FPCs placed in each layer, to determine the size of each 1PNL board to determine the number of FPCs that can be placed in a layer (the distance from the board to the four sides of the silicone needs to be kept more than 7cm), when placing the board, the FPC should be placed in the silicone ** part, and the spacing of each board is 2cmThe thickness of the FPC placed in each layer should be the same (for example: single-sided board should not be mixed with multi-layer boards) for each opening, the graphics of FPC placed on each layer should be the same, and the position and order of the graphics should be roughly the same. When placed, the FPC film surface or the reinforcing side of the patch should be facing up. The release film should be covered flat on the flexible board, and there should be no wrinkles and folding. After the operation is completed, the stacked FPC is placed flat on the conveyor belt and sent to the next process.

Gloves or finger covers must be worn when stacking

Before lamination, check whether the steel plate is uneven, and whether the silicone is broken, cracked, and bee eyes. Whether the release film is sticky with garbage. The steel plate silicone release film without the above undesirable phenomena can be suitable for the production of stacks, and when the position and pattern of FPC are placed consistently, the front and back sides of the release film must be confirmed first. How to confirm:

1.Use an oil-based pen to draw on the corner of the release film, if the handwriting is clear, it will be the reverse side, and if it is not clear, it will be the front.

2.Wear white gloves to touch the release film, there is a smooth side that can be strong for the front, and vice versa.

Production process: Lamination and press-lamination plating before film removal.

Lamination process: Drilling, pasting BS film, overplastic, pressing substrate, casting, CU plating, dry film, etching, pretreatment, filming, lamination, pressing, inspection, and the next process.

Production material configuration:

Name Specification.

Steel plate 550*500mm

Silicone 500*500mm

Release film 500*500mm

a.Lamination: Put a steel plate on the laminated table Silicone Release film Flexible board Release film Silicone Steel plate and so on. The stack+ layer is an opening.

b.Feeding: Two people stand on both sides, grasp the stacked 10 layers (one opening) of the board together in front of the front and back, gently and slowly lift it to the edge of each opening in front of the press, and slowly push it to the middle of the template. It is not allowed to grasp only one layer of steel plate or push only one steel plate to prevent the dislocation and sliding of the release film of the steel plate, silicone and flexible board.

Stacked structure

Steel plate --silicone**

Release film --

FPC ++ Release Film --

Silicone **steel plate --

c.Pressing: After the laminated plates are opened one by one, press the "Closed Mold" button on the control panel of the machine, and when the template is opened to the top, it will automatically stop and enter the pre-loading state. After 10-15 minutes of preloading, the pressure must be adjusted to the process parameters of the pressed model, see the "List of Pressing Parameters" for details, and then enter the forming and pressing state.

d.Cooling: When the forming and pressing time is up, the cooling water switch on the control panel is turned on, the four valves of the water inlet pipe are also opened, and the heating switch is closed. The temperature can be lowered below 80 before discharge. And turn off all the water inlet switches of the cooling water switch. Turn on the heat switch to heat up and prepare for the next time.

e.Blanking: After the cooling time is sufficient, press the mold opening button. When the press begins to unpressurize, and when the template is lowered to the bottom, wear thick gloves, stand on two sides separately, and lift out the 10 layers of each opening. Lift the steel plate silicone release film layer by layer, and place the steel plate silicone together. Waste release liner is disposed of in the trash. The pressed flexible board is separated by PP sheets.

a.Press-fitting machine.

Before pressing, it is necessary to check whether the machine table is clean, whether the steel plate is deformed, whether the silicone is damaged, and whether the release film is wrinkled.

b.Parameter setting:

Temperature, time, pressure.

175 10 Pressure 30-60min 10-15MP

Curing. Temperature time.

150±10℃ 1-2h

a.Fast-pressure pressure transfer switch

a.Close the main power switch and turn the switch to the "on" position. The power indicator light on the electrical cabinet is on;

b.Select Manual operation and press the mold closing button. The oil pump motor is running, and the mold closing indicator light is on. The plunger drives the hot plate to open and close the mold under the action of hydraulic pressure, and then the pressure is raised. When the hydraulic pressure in the hydraulic cylinder rises to the lower limit of the table, the oil pump starts to work. Pump at the maximum limit. So as to complete the mold closing action.

b.After the molding is completed, press the mold opening button, and the motor operation indicator light will be on, and the mold will be opened. When the plunger is lowered, the pump stops when it hits the touch line switch.

c.The heating control system temperature control is a digital temperature regulator to achieve automatic detection. The temperature of the mesh plate can be read out by the regulator on the electrical cabinet, the lower row is the set temperature, and the upper row is the actual temperature display. The "out on" button on the panel controls the start and stop of the heating temperature.

d.Oven on/off

a.Set the temperature and time, then press the "Start" button to start heating the heater

b.When it is heated to the set temperature, wear anti-high temperature gloves, open the oven door, put the soft plate into the oven, and close the oven door

c.When the set time is reached, the alarm goes off. At this time, you only need to turn off the "electric heating" button, and wait for the temperature to drop below 50 before taking out the flexible board

d.If you need to work again, just turn the "Heat" button on.

a.Uncompact: that is, the encapsulation film is not strong and compact.

1.The line conductor must have 0Pitch of 13mm or more.

2.When the area between the conductors exceeds 20% of the line spacing, the pressure is backpressurized.

3.The length of the uncompaction area exceeds 013mm for rework.

b.Air bubbles: that is, there is air between the encapsulation and the copper foil, and the shape is convex.

1.When the bubble length is 10mm, it is judged to be ng

2.When the bubble crosses two conductors, it is judged to be ng

3.When the bubble touches the shape, it is judged to be ng

c.Line twisting: Line twisting, kinking phenomenon is not allowed.

d.Glue overflow: The glue of the encapsulation film overflows the cu surface.

Glue overflow area 0When it is 2mm, it is judged to be OKThe amount of glue overflow of the pad with holes is 1 4 The pad area is judged to be OKThe minimum solderable amount of hole side pad is not less than 01mm.

e.Residual glue in the hole: No residual glue in the hole is allowed.

f.Creas, indentation, crush (breaking the line, causing damage to the line for scrapping).

The length of the fpc surface scar is 20mm, and the depth is obvious, and other minor ones are not allowed to be treated by UAI.

g.Reliable performance test:

a.Peel degree test.

b.Thermal shock performance test.

Related Pages