Dry ice cleaning PCBA circuit boards, suitable for various material surfaces

Mondo Technology Updated on 2024-01-30

A significant advantage of dry ice cleaning PCBA boards is that they can be used on a variety of surfaces, including but not limited to the following:

Metal Surface:Dry ice cleaning is very effective on metal surfaces, including copper, aluminum, tin, gold plating, silver plating, etc. It can help remove oxide layers, solder spat, flux, and more.

Plastic surface:For plastic circuit boards or plastic components, dry ice cleaning is a gentler cleaning method that does not cause the plastic to deform or melt, making it suitable for cleaning plastic surfaces.

Glass surface:Dry ice cleaning effectively cleans glass surfaces and removes adhered dirt, grease and other impurities.

Ceramic surface:For ceramic materials, dry ice cleaning is also suitable for quickly and effectively removing dirt from surfaces.

Silicon surface:Dry ice cleaning is also an effective cleaning method for silicon surfaces, which can be used to remove dust, grease, etc. from silicon wafers.

Electronic Component Surface:For electronic components on PCBA circuit boards, dry ice cleaning is a safe cleaning option because dry ice particles are non-conductive and do not negatively affect electronic components.

Stainless steel surface:Dry ice cleaning is also effective on stainless steel surfaces, removing grease, dirt, and oxide from the surface.

PCBA cleaning methods and skills PCBA cleaning liquid cleaning methods of dry ice cleaning PCBA.

Dry ice cleaning machine is suitable for 13 major industry fields.

Since dry ice cleaning is based on the principle of physical impact and freezing, rather than chemical properties, it has good applicability to various material surfaces. However, when using dry ice cleaning, it is still necessary to consider the specific cleaning requirements and material characteristics, and it is recommended to clean in large quantities after small-scale verification to ensure a safe and efficient cleaning process.

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