One-stop PCBA intelligent manufacturing manufacturers today will tell you what is the reason for SPCBA processing wave soldering and tinningThe method of solving the problem of PCBA processing wave soldering and tinning. In the wave soldering process, the solder material is preheated during soldering to lift the solder liquid to a certain height through the wave wave to form a tin wave, and the components that need to be soldered are placed above the tin wave, so that the solder liquid can wet and coat the surface of the solder joint of the component to form a solder joint. In this process, the solder liquid is applied to the surface of the component's solder joints to wet and fill the weld seam, resulting in a solder joint.
The reasons for PCBA processing wave soldering may include the following aspects:
1.Solder alloy properties: The solder alloy needs to have good wettability and fluidity so that the solder liquid can wet and fill the weld during the soldering process, resulting in a complete solder joint.
2.Crest height and period: The choice of crest height and period also has a great impact on the quality of the weld. The reasonable matching of the crest height and cycle can make the time and degree of solder liquid wetting the surface of the solder joint of the component reach a good state, so as to form a good solder joint.
3.Component solder joint design: The solder joint design of the component can also have an impact on the quality of the welded joint. Reasonable solder joint design can increase the contact area of the welded joint, improve the welding strength and stability.
4.Welding process parameters: The selection and adjustment of welding process parameters will also have an impact on the quality of welded joints. For example, the adjustment of welding temperature, welding speed, crest height and cycle can achieve good wetting and filling results of welded joints.
The method of solving the problem of PCBA processing wave soldering and tinning.
In the PCBA wave soldering process, if there is a situation of tinning, corresponding measures need to be taken to deal with it, and the common methods are as follows:
1.Adjust soldering process parameters: Appropriately adjust soldering process parameters, such as soldering temperature, crest height, cycle, etc., to reduce the wetting time and degree of wetting during soldering, and prevent solder from forming tinning on the solder joints of components.
2.Replace the solder alloy: Try to replace the solder alloy with better wettability and fluidity to make the soldering process more stable and reduce the possibility of soldering.
3.Replacement components: Some components themselves have poor wettability and are prone to tin connection, so you can consider replacing other components with good soldering performance.
4.Check the surface treatment of PCB boards and components: Improper surface treatment of PCB boards and components can also easily lead to the occurrence of tin-connected phenomenon, you can check whether there are problems such as oil stains and oxidation, and clean and treat the surface in time.
5.Check the equipment: check whether the wave soldering equipment has faults, such as unstable solder bath temperature, inconsistent peak height, etc., and repair or replace the equipment in time.
In a word, in the PCBA wave soldering process, tinning is a common problem that needs to be adjusted according to the actual situation.
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