Semiconductor + chip + new industrialization + CPO + satellite Internet + storage + AI + unmanned driving + robot + Huawei + 5G + data elements, etc.
Semiconductor Equipment: Etching Equipment, Monocrystalline Silicon Furnace, Deposition Equipment, Testing Equipment, Cleaning Equipment, Polishing Equipment, Ion Implantation Equipment, Gluing and Developing Equipment, Other Equipment.
New industrial machinery: industrial machine tools, textile industry, coal industry, construction machinery, comprehensive equipment.
CPO in co-packaged optics: optical devices, quartz crystal oscillators, optical chips, ceramic shells, optical filters.
Satellite Internet components: chips, receivers, positioning equipment, sensors, antennas and ground.
Memory chips: DRAM, NAND FLASH, NOR FLASH, EEPROM, HBM, etc.
AI industry applications: e-commerce: brand service providers, integrated services, e-commerce shopping guides, e-commerce platforms, bulk commodities, live broadcasting, advertising, SaaS systems.
Unmanned decision-making system: assisted driving, automatic parking, intelligent cockpit, head-up display, inertial measurement unit.
Humanoid robots: general reducer, harmonic reducer, reducer, RV reducer, gearbox, bearing.
Car cockpit: zero-gravity seats, BC endoscopes, interior, instrument cluster, steering wheel.
Huawei ecosystem operating system: core partners, databases, firmware, fonts.
Chip classification: Bluetooth audio, LED driver, light sheet, security**, connection, etc.
Huawei computing power: servers, switches, optical communications, and computing power leasing.
Data elements: data storage, data trading, data replication, industry data, etc.
5G: optical fiber and cable, network construction planning, telecom operation, communication equipment, etc.