In printed circuit board (PCB) manufacturing, the half-hole process is a common process. The so-called half-hole is to punch holes only at the edge of the plate, rather than a full hole from end to end. This process has many advantages, including increased pad strength, faster production cadence, and more. This article will elaborate on the PCB half-hole process from four aspects to help readers better understand and use this process.
First, the working principle of the half-hole process.
The half-hole process is a method in which only half of the holes are punched along the edges of the printed circuit board. This process can be used to increase the strength of the nail feet on larger pads, resulting in more stable pads, while also reducing the number of drilled holes, speeding up the production rhythm and increasing the productivity of the PCB.
Second, the production method of the half-hole process.
For ordinary PCBs, the half-hole process is very simple, you only need to design the pad that needs to be half-hole with a wide burst during the layout design, and then press the drill bit to a depth of about 1 mm on the edge of the PCB board during the manufacturing process. It is important to note that this process is only suitable for ordinary PCBs, and for high-density printed circuit boards, it is not suitable for this process due to its high pad density.
3. Advantages and disadvantages of the half-hole process.
The half-hole process has many advantages, one of the main ones being that it increases the strength of the pads, which makes the pads stronger. In addition, the use of the half-hole process can also reduce the number of drilled holes, making the PCB manufacturing faster. However, this process has some drawbacks, the biggest of which is that it cannot be used for high-density printed circuit board fabrication, as the pads are too dense for half-hole processing.
Fourth, the scope of application of the half-hole process.
The half-hole process is suitable for manufacturing printed circuit boards with large pads, such as in products such as flat displays and LED light boards. In addition, the half-hole process is also suitable for circuit boards assembled by surface mount technology (SMT).
The half-hole process plays an important role in PCB manufacturing, which can improve the strength of the pads and accelerate the production rhythm of PCBs, which has many advantages. However, its scope of application is also limited, and it needs to be selected according to the actual situation. Hopefully, this article will enlighten the PCB half-hole process and help readers in PCB manufacturing.