In recent years, with the rapid development of miniaturization and high functionality of various electronic products, semiconductor processes have continued to develop in the direction of high integration and high density, and various light, thin, short and small packaging structures have been continuously developed, and at the same time, the requirements for semiconductor active devices are getting higher and higher. Semiconductor active devices need to be able to withstand higher current shocks while generating more power, so they need to have better heat dissipation performance in high-temperature environments. In the thermal characteristics of the chip, the connection methods generally involved include the connection between the die and the peripheral circuit of the package (primary connection), the connection between the component and the PCB board or the connection between the component and the component (secondary connection), and for some ultra-high power density chips that need to implement micro-nano scale cooling channels inside the chip, the connection between the internal circuits of the wafer (zero-level connection) also needs to be considered.
In summary, under the same size and under the same packaging conditions, the heat dissipation area of the product with heat sink is significantly increased and the heat dissipation efficiency is higher when the heat sink is added at the top or bottom of the package body compared with the conventional packaging method without heat sink. Therefore, in order to improve the heat dissipation efficiency without changing the packaging form, adding heat sinks is a more important way, and there are two common chip heat dissipation methods, namely the bottom heat dissipation mode and the top heat dissipation mode
Under the same parameters, the thermal ** analysis of the top heat dissipation product and the bottom heat dissipation product was carried out, and the resistance values of Theta-JA and Theta-JB were evaluated under the Jedec standard, and the results showed that the top heat dissipation performance was better than the bottom heat dissipation, and the reliability of the products could meet the MSL 1 2 3 standardIn response to market demand, Huatian Technology has also developed the packaging technology of top heat dissipation, and Huatian Technology has adopted the processing method of frame reverse molding in the field of traditional leaded packaging (LQFP, SSOP, etc.) and leadless packaging (QFN DFN), and developed the heat dissipation method of top PADAt the same time, Huatian Technology has also developed a way to add heat sinks and heat dissipation covers on the top in the field of substrate packaging, such as EHS-BGA and HFCBGA.
At present, the top heat dissipation frame packaging products developed by Huatian Technology are used in audio amplifier products of consumer, industrial and automotive electronic products, and their output power is between 2W and 50W. The developed packaging products such as EHS-BGA and HFCBGA are also used in scenarios with high computing power requirements, such as CPUs and GPUs for notebooks, PCs, and servers. In the future, Huatian Technology will gradually develop other top heat dissipation methods in the form of packaging to meet the needs of market applications and better serve customers.
About Huatian TechnologyHuatian Technology (parent company Tianshui Huatian Technology Co., Ltd. was established on December 25, 2003 and successfully listed on the Shenzhen Stock Exchange on November 20, 2007 (**002185). Mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components, as a well-known global semiconductor packaging and testing enterprise, Huatian Technology provides customers with one-stop service, with advanced technical capabilities, intelligent production systems and quality control, has become the preferred brand in the semiconductor packaging and testing industry. The company's revenue ranks third among domestic peer listed companies, and ranks sixth in the global integrated circuit packaging industry. The main business includes: packaging design, packaging**, lead frame packaging, substrate packaging, wafer-level packaging, wafer testing and functional testing, logistics and distribution and other one-stop services.