2nm can be manufactured without an EUV lithography machineJapan officially stated its position, foreign media: no wonder ASML changed its hexagram.
With the rapid development of science and technology, semiconductor wafers have become a key component in the development of modern science and technology industry, and their manufacturing technology has also become the pinnacle of competition among countries. However, manufacturing advanced wafers only requires high-precision lithography machines, and the EUV lithography machine produced by the Dutch company ASML is one of the most advanced equipment today, but due to the influence of the US intervention, Chinese technology companies cannot buy such equipment, which brings great problems to the development of China's semiconductor industry.
However, Japan's technological prowess in the field of semiconductor manufacturing should not be underestimated. Recently, Japan officially announced that Canon has developed a 5nm NIL process, and it is expected to reach a 2nm NIL process as early as 2026. The emergence of this technology means that 2nm chips can be created without EUV lithography, which is undoubtedly great news for China's semiconductor industry
What is the NIL process?The NIL process is a completely new wafer fabrication technology that does not use a lithography machine and creates smaller wafers by depositing material directly on the surface of the wafer. Compared to traditional lithography manufacturing techniques, the NIL process is more accurate, less costly, and more environmentally friendly. Therefore, the NIL process is considered to be a promising new wafer fabrication technology.
In fact, in addition to Canon, there are many Japanese companies that have strong capabilities in the field of semiconductor manufacturing. For example, Tokyo Electron has developed a product called"Electron beam lithography"can project an electron beam pattern directly onto a silicon wafer, resulting in smaller wafers. In addition, there are many companies in Japan that are developing other new wafer manufacturing technologies, and the emergence of these technologies will bring more opportunities and challenges to the development of China's semiconductor industry.
It is worth mentioning that as one of the world's most advanced semiconductor manufacturing equipment manufacturers, ASML in the Netherlands has the EUV lithography machine required to manufacture wafers smaller than 7 nanometers. However, with the intervention of the United States, China was unable to obtain this equipment. However, as Japan's technological prowess in the semiconductor manufacturing sector continues to grow, ASML's market share is facing significant challenges. No wonder there are foreign ** reports that ASML has begun to retreat and speed up shipments to the mainland market!
Of course, the development of China's semiconductor industry is also facing many challenges and difficulties. First of all, China needs to strengthen its independent R&D and innovation capabilities to improve its core competitiveness in the semiconductor field. Second, China needs to strengthen cooperation with the international community to attract more high-end talents and resources to the Chinese market. Finally, China also needs to strengthen the integration and modernization of the industrial chain to improve the synergy and efficiency of the entire industry.
However, with the continuous enhancement of Japan's semiconductor manufacturing technology strength, China's semiconductor industry has also ushered in new opportunities and development space. First, Japan's technological prowess provides China with more options and opportunities. China can improve its manufacturing level and competitiveness by introducing advanced technology from Japan. Second, Japan's technological strength also provides China with more opportunities for cooperation. China can work with Japanese companies to develop and promote new wafer fabrication technologies. Finally, Japan's technological prowess will also contribute to the development and growth of the semiconductor industry throughout the Asia-Pacific region.
In short, with the continuous progress and development of science and technology, the development of the semiconductor industry is facing more and more opportunities and challenges. In this context, China needs to strengthen independent R&D and innovation to enhance its core competitivenessAt the same time, it is also necessary to strengthen international cooperation, attract more high-level talents and resources to enter the Chinese market, strengthen the integration and upgrading of the industrial chain, and improve the synergy and efficiency of the entire industry, so as to better promote the rapid development of China's semiconductor industry and make greater contributions to the growth of the country's economic developmentContribute!