WPG Holdings, --- a leading international distributor of semiconductor components dedicated to the Asia-Pacific market, announced that its subsidiary, AIT, has launched the LE Audio smart speaker solution based on Qualcomm's QCCC3083 chip.
Figure 1 - WPG Audio's LE Audio smart speaker solution based on Qualcomm products.
On January 31, 2023, the Bluetooth SIG officially announced the Bluetooth Core Specification v5Version 4, which adds four new features, namely support for Periodic Broadcast with Response (PAWR), Support for Encrypted Broadcast Data (EAD), Le GATT security level feature, and broadcast code selection. These features further enhance the security of Bluetooth wireless communication technology and help improve the user experience of Bluetooth mesh networks and various GATT-based Bluetooth applications. Bluetooth 5On the basis of 4 technologies, WPG AIT has launched the LE Audio smart speaker solution based on the Qualcomm QCCC3083 chip, which can be widely used in commercial, medical, family, education and other scenarios.
Figure 2 - Scene application diagram of WPGD's LE Audio smart speaker solution based on Qualcomm products.
The QCC3083 supports LE Audio and Auracast broadcast audio capabilities, which enables users to share with many Bluetooth speakers or headphones**. The chip also supports Qualcomm's Snapdragon Sound lossless, low-latency, and powerful ** streaming technology to deliver a superior listening experience in complex environments. In addition, the QCC3083 has a 24-bit 96kHz sampling frequency, an IS I/O interface, and supports the Qualcomm CVC call noise reduction algorithm, which makes the QCC3083 particularly suitable for audio applications.
Figure 3 - Block diagram of WPGD's LE Audio smart speaker solution based on Qualcomm products.
This solution provides a convenient and flexible way to realize the transmission and amplification functions of audio, such as voice control of home devices, schedule reminders, game interaction, etc.
Core technical advantages:
Bluetooth v5 compliant4 specifications, support LE Audio LC3 codec audio and Auracast broadcast audio;
Frequency up to 240MHz Qualcomm Kalimba audio DSP;
High-performance 24-bit 96kHz stereo audio interface;
Supports up to 6 digital and analog microphones;
Support 3-microphone call noise reduction;
Supports Qualcomm's APTX and APTX HD, APTX Adaptive, APTX Lossless, Snapdragon Sound;
Rich interfaces: UART, I C SPI, USB 20，i²s，pio；
VFBGA Small Package: 134-Ball 67mm×7.4mm×1.0mm。
Program Specifications:
Audio system: 240MHz audio processing DSP;
384KB RAM and 1024KB RAM.
Application system: 32bit, dual 80MHz main frequency application processing DSP;
Supports external 32MHz or 80MHz QSPI memory.
Bluetooth system: Bluetooth v54 Specification, 1m 2Mbps BLE, le audio;
Output power chass 1 standard, 13dBm.
Lithium battery charging:
Built-in high-performance battery charger, support internal 200mA, external 1800mA charging current;
The maximum charging cut-off voltage is supported65v to 44v；
Built-in temperature detection to control the charging current.
Power management: Support USB, lithium battery, external power supply (2.)8v to 6.5V) power supply;
Output power chass 1 standard, 13dBm.
Built-in dual SMPS outputs for chip and external use,18v and 11v。