Is the Sino-US core war expected to turn around? Packaging technology is no longer regulated, Chinese mainland has an opportunity?
After the outbreak of the Sino-US war, the semiconductor industry in the world suffered a huge blow, the overall pattern of the world was completely destroyed, and the world pattern changed dramatically. Every time the industry changes, a number of companies are eliminated, and some are eliminated, which is an opportunity and a challenge for China's semiconductor industry!
Not long ago, the United States ** had a nuclear war between China and the United States, and Wall Street ** said that Chinese mainland may adopt packaging technology, which is an opportunity. What's going on?
As we all know, TSMC and Samsung have completed mass production of the 3 nm process, and ASML has also handed over the world's first 2 nm lithography machine to Intel, which is expected to be put into production in 2025. This marks that the world's semiconductor industry has fully entered the stage of 3 nm and is developing in the direction of 2 nm.
Due to the emergence of new technology products one after another, the production of chips is becoming more and more difficult and costly. This is true both in terms of technology and expense. China's chip manufacturers follow suit"The way you are"It is difficult to rely on limited technology, hardware, materials and software"Catch up", or catch up or exceed. Therefore, Chinese chips must take a new path in order to really crack them"Stuck neck"Puzzle.
Newspapers in the U.S. have focused on a new direction, namely how to use wafer packaging to produce more efficient chips. This may be a complex concept, but when it comes to stacks, I believe many people are familiar with it, and many chip manufacturers have begun to work on research and development in this field.
Among them, TSMC, the world's largest chip manufacturer, has also adjusted its strategy and increased investment in packaging, and TSMC plans to double TSMC's advanced packaging technology (CODOS) capabilities by 2024. There is no doubt that with the severe test of technology and economic situation, the chip giant is looking for a new way out.
In fact, wafer fabrication is a very complex process involving design, production, and packaging. Compared with design, production and packaging, Chinese mainland has made great progress in packaging technology, so the American media China's opportunities are also called China's opportunities. So the news in the U.S. says, "Here's an opportunity for China," because they want to see something clearer and more thorough.
And, when it comes to packaging, the United States has no constraints, we can"Together"to use their power with greater leeway. Objectively speaking, if China's semiconductor manufacturers concentrate on the production of integrated circuits, they will encounter many problems such as lithography and wafer production. If China's chip manufacturers focus on chip design, the above problems will occur, such as industrial design software. However, as long as you focus on the chip, you can solve this problem and even create a new miracle!
There is no doubt that the United States' suppression of China's hinterland in the past will not stop, and will become more and more fierce in the future, and even stretch out its hand to the outflanking area, but as soon as there is an opportunity, we must strive for it, time is not waiting, the most important thing in the Sino-US dispute is to seize every minute and every second, this is a new test for China's development, I wish you all a safe pass!