Is the Sino-US core war expected to turn around? Packaging technology is not regulated, Chinese mainland has opportunities?
As we all know, after the outbreak of the core war in the United States, the global semiconductor industry was impacted, and the entire industry was unbalanced and a lot of changes occurred. Various changes in the industry have destroyed some enterprises, but also created some enterprises, which is both a danger and an opportunity for China's semiconductor industry!
The United States commented on the Sino-US nuclear war some time ago. Wall Street** believes that packaging technology is an opportunity in Chinese mainland. What does this mean?
As we all know, TSMC and Samsung have achieved mass production of 3nm chips, while ASML has provided Intel with the world's first 2nm lithography equipment. In other words, the global semiconductor industry has now fully entered the 3nm era and is transitioning to the 2nm era.
With each new generation of new technology coming to market, chip manufacturing also becomes more complex and expensive. Both technology and cost are becoming more and more complex. If Chinese chip companies want to be in technology, equipment, materials, software, etc"The way you are"After catching up, it was almost impossible to complete the task, because under the strong pressure of Lao Mei,"Stuck neck"The background is limited to completion or transcendence. Therefore, China core wants to solve"Stuck neck"The problem is to find another way and open up a new track.
The United States** is focusing on new ways to use chip packaging technology to make more powerful chips. This may sound mysterious, but these four words are not unfamiliar to many people, and in terms of stacking technology, I believe that many chip manufacturers are already conducting research in this area.
TSMC, the world's largest chip manufacturer, has also changed its strategy and increased investment in packaging technology research and development; TSMC aims to double the production capacity of COWOS (TSMC Advanced Packaging Technology) by 2024. Clearly, there are significant challenges in both technology and business at the moment, and chip giants are starting to look for other ways out.
In fact, chip manufacturing is a very complex process involving design, manufacturing and packaging, and Chinese mainland can make breakthroughs in this area faster than design, manufacturing and packaging. Chinese mainland has made significant progress in packaging technology. That's why the United States says:"This is an opportunity for Chinese mainland"。That's why the United States says:"This is an opportunity for Chinese mainland", because it is very common.
In addition, due to the uncontrollable nature of the packaging technology, it is not necessary to cooperate with the United States"Head to head"can be suppressed, so there is room for force. Objectively speaking, if Chinese chip companies focus on the field of chip manufacturing, they will face many problems such as lithography technology and chip manufacturing technology. If Chinese chip companies focus on the field of chip design, they will not only face the above problems, but also the problems of industrial design software. However, if we can focus on the field of packaging, we may be able to avoid the previous problems and create new miracles!
There is no doubt that the United States' suppression of China's core is not over, it may intensify in the future, and its hand may even reach into the field of the bag, but as long as there is an opportunity, we must challenge, and time is money, in the war between the United States and the core of China, in the war, we must seize the opportunity, this is a new challenge to China's speed, I hope we can pass smoothly!