Last year, AMD engineers leaked the news of the ZEN 6 architecture, saying that the internal code name of the ZEN 6 architecture core is "Morpheus", which will be manufactured using a 2nm process. If you choose to continue working with TSMC, with its semiconductor process progress, it means that processors based on the ZEN 6 architecture could arrive as soon as late 2025 to early 2026. 
Recently, some netizens said that AMD will have a major change in the zen 6 architecture and will adopt 25D interconnect technology instead of traditional multi-chip designs, which can increase bandwidth between chiplets and reduce latency. At the same time, client processors based on the ZEN 6 architecture will skip the RDNA 4 architecture and directly adopt the RDNA 5 architecture in terms of core graphics. This means that the Zen 6 architecture Ryzen processor may use a more advanced semiconductor process, and it is rumored that different modules may be manufactured on 2nm and 3nm processes respectively. Actually, everyone is interested in 25D interconnect is no stranger, and the current N**i 31 32 chip based on the RDNA 3 architecture demonstrates this design, which is composed of GCD (graphics computing chip) and MCD (multi-cache I-O chip), and uses two different process technologies at the same time. On Zen 6-based Ryzen processors, AMD is likely to continue with a dual-CCD with a single-IOD design, which is likely to get bigger to include more new technologies.
There have also been rumors that AMD does not plan to stack IODs on CCDs for the time being, as it would be too expensive to manufacture, but may try to introduce such a design in the future.