In 2024, Vientiane Xinsheng and Huawei HiSilicon will release a mysterious poster, what does it portend?
With the release of Huawei Mate60 Pro, the Kirin chip is officially back, although Huawei has not yet released specific information, but it is certain that the Kirin 9000 chip has reached or approached the level of 7 nm.
Huawei's Kirin 9000 chip, through the optimization of the core layout, the use of hyper-threading technology, the use of advanced packaging technology, the Qualcomm Snapdragon 888 reached 5 nm.
Hongqiao 900, Shengteng 910B, Kirin 9000 SL, Kirin 8000, etc., in the words of Xu Zhijun, President of Huawei, Huawei has achieved 70% of domestic chips.
Not long ago, Huawei's HiSilicon released a poster titled "2024, the Year of Global Chips", which also revealed a lot of information.
First of all, in 2024, Huawei will undoubtedly enter the chip market.
In terms of semiconductor chips, Huawei has made breakthroughs, not only chips like Kirin 9000, but also EDA tools above 14 nm, and Huawei HiSilicon will also release a new product at some point in this year.
Yu Chengdong said in public that Huawei will launch a new product one after another this year, which Yu Chengdong did not disclose, but it is likely to be a Kirin chip.
Secondly, Huawei HiSilicon has already played"Pioneer core"This poster indicates that future technology and chip innovation will usher in an important turning point.
Ren Zhengfei said that Huawei is going through an increasingly difficult but increasingly successful period, and there is no doubt that Huawei will achieve greater success in the field of semiconductor chips.
The Kirin 9000 has already astounded the world, and the Ascension 910B is highly regarded by Huang.
According to reports, Huawei released the "Lingxi" instruction set, which is another major breakthrough in the core technology of chips such as "Da Vinci" and "Taishan".
After all, Huawei's chips are based on ARM technology, but Huawei cannot carry out later architecture upgrades like V9, that is, if Huawei chips want to make breakthroughs in performance, they need to develop new architecture technologies.
The advent of the Lingxi command system has given Huawei the opportunity to fully replace ARM chip technology.
There is no need for Huawei to use Arm technology, since its architecture and command system are ready-made. Based on its self-developed architecture and command system, Huawei is able to manufacture chips that can be continuously optimized and updated.
Finally, there are Huawei's own developed chips, from Kirin, Shengteng, Barong to Kunpeng, Huawei basically uses chips, basically independent research and development, and the market demand is still very large.
Almost all of Huawei's chip orders are obtained from TSMC's foundries, and their annual sales are close to 40 billion yuan, growing even faster than Apple's.
After that, TSMC could not provide chips, which directly led to the inability to mass produce high-end chips independently developed by Huawei, and chips such as Kirin 9000 have been made in China, while Huawei's HiSilicon chips have not yet fully recovered.
Huawei's HiSilicon announced 20.24 million chips, which also means that HiSilicon will usher in a new era, and all of this will come in 2024.
After all, Huawei is increasing its R&D investment, which will reach RMB 115 billion in the first three months of 2023.
All in all, Huawei HiSilicon put forward a target of 20.24 million, although Lu Zhou did not reveal too much, but it can also be heard from this statement that Huawei will have a big event in 2024.
Before the release of the Huawei Mate60 Pro mobile phone, Yu Chengdong publicly said that Huawei's flagship machine was about to be discontinued, but only a month later, Huawei launched a new machine.