Epoxy encapsulant is widely used in electronics, aerospace, automotive and other fields due to its excellent performance. According to its viscosity, the application scenarios and advantages of epoxy encapsulants also have their own advantages.
High Viscosity Epoxy Encapsulant:
Application scenario: It is suitable for occasions with high requirements for sealing and durability, such as potting of electronic components, sealing of large mechanical parts, etc.
Advantage: High strength: Excellent pressure, impact and shear strength.
Moisture-proof and dustproof: Good sealing performance effectively isolates the external environment and protects internal components.
Chemically resistant: Resistant to a wide range of chemicals, ensuring long-term stability.
Medium viscosity epoxy encapsulant:
Application scenarios: It is suitable for potting small and medium-sized electronic components, circuit board protection, etc.
Advantages: Good flowability: Able to evenly fill the gaps and ensure consistent potting results.
Fast curing: improve production efficiency and shorten production cycles.
Excellent electrical properties: low dielectric constant and dielectric loss to ensure electronic performance.
Low Viscosity Epoxy Encapsulant:
Application scenario: It is suitable for large or irregular surfaces that need to be quickly penetrated and filled, such as cement prefabricated panels, building joints, etc.
Advantages: Excellent permeability: Ability to penetrate quickly into irregular surfaces for uniform potting.
Easy application: It can be sprayed or brushed directly, reducing the difficulty of operation.
Low cost: It can be applied to large-area construction and reduce the cost per unit area.
In summary, epoxy encapsulants with different viscosities have their own characteristics and are suitable for different application scenarios. Choosing the right encapsulant not only ensures the best potting results, but also increases efficiency and reduces costs.