Reflow soldering works on the principle of thermal expansion and contraction of a substance, which melts the metal powder in the solder paste by heating, and then gradually increases the temperature to allow it to cool and solidify quickly, thus achieving a strong connection between the assembly and the circuit board.
The process of reflow soldering is mainly divided into the following steps:
1.PCB surface treatment: Degreasing and decontamination of the PCB surface is carried out first, and then solder paste is applied to the area that needs to be soldered.
2.Automatic Component Alignment: Components are placed sequentially in predetermined positions using automated equipment.
3.Soldering: The PCB coated with solder paste is placed in a reflow oven, and the metal powder in the solder paste is melted by heating, and then cooled and cured to complete the soldering.
4.Inspection: Check the appearance and electrical properties of the soldered circuit board to ensure that the soldering quality meets the requirements.
Reflow soldering technology has the advantages of high efficiency, high precision and high quality, and is widely used in the electronics manufacturing industry. At the same time, there are still some problems in reflow soldering technology, such as high requirements for temperature control and high requirements for solder paste quality, which need to be paid attention to during use.
Materials** on the Internet.