On January 29, according to Taiwan media reports, the semiconductor business of panel manufacturer Innolux has successfully won a large order for panel-level fan-out packaging (FOPLP) of European semiconductor manufacturer NXP (NXP). NXP has contracted almost all of Innolux's related production capacity, which will be mass-produced and shipped in the second half of the year.
It is understood that Innolux has been deploying panel-level fan-out packaging technology for eight years, and winning the NXP large order this time will make the chip-first process built by Innolux in the early stage of the production capacity fully loaded, and this year it is ready to launch the second phase of the expansion plan to prepare for mass production in 2025.
According to the report, Innolux is based on the existing 3The fifth-generation panel production line has been transformed into a panel-level fan-out packaging product, and the relevant depreciation has almost come to an end, so the gross profit margin is very good. This is also the first order for Innolux's layout of semiconductor packaging, which gives new momentum to Innolux's operation when the TV panel is stable.
In July 2023, Innolux held a press conference at the "2023 International Semiconductor Exhibition" to announce the "starting house" of the first factory located in Nanke3The 5th generation line has successfully "turned around", and the panel-level fan-out packaging technology produced is suitable for automotive and power chip packaging products that require reliability and high power output, and has been sent to customers for verification, and is expected to be mass-produced by the end of 2024, with a monthly production capacity of up to 150,000 pieces.
It is reported that Innolux's panel-level fan-out packaging technology has two advantages of efficiency and cost, and has the characteristics of high power and lightness, which has become the main factor for NXP to place orders. Innolux originally planned to target the two major application markets of automotive and mobile phones in the initial stage of panel-level fan-out packaging technology.
Innolux Chairman Hong Jinyang previously said that Innolux's first factory is 3The 5th generation line of the old panel factory, has completed depreciation and amortization, the cost of production and manufacturing is relatively low, the use of panel-level fan-out packaging technology packaging chips are not only expected to reduce the overall cost, reliability has also been improved, is expected to provide a new technical path for advanced packaging.
Yang Zhuxiang, general manager of Innolux, pointed out that panel-level packaging has low resistance and reduces chip heating characteristics in wiring, which is most suitable for chip applications such as automotive ICs and high-voltage ICs, and aims at new applications of DR-MOS three-in-one energy-saving components.
Hong Jinyang also previously revealed that Innolux's capital expenditure in panel-level fan-out packaging technology in recent years has reached NT$2 billion, which is a "lightweight" investment compared to the capital expenditure of panel factories that often cost tens of billions of NT$10 billion per share. Innolux started at 3The 5th generation factory has built RDL-FIRST and Chip-FIRST packaging II processes, the former is mainly used in communication products; The latter is aimed at the market for chips required for fast charging of vehicles.
Hong Jinyang said that although the chip-first production capacity built in the first phase of Innolux has not yet been mass-produced, it has been fully booked by customers. The heat of customer queuing can be called "unexpectedly warm", and it is also the warmth that panel factories have not felt for a long time.
However, regarding the rumors that NXP has won a large order, Innolux said on the 28th: "I don't comment on market rumors and customers." ”
Editor: Xinzhixun-Rogue Sword.