Intel announced a new process technology roadmap and customer and ecosystem partnerships to achieve its goal of becoming the world's second-largest foundry by 2030.
News Highlights: Intel Foundry, the first system-level foundry for the AI era, is a leader in technology, resilience and sustainability.
Intel Foundry announced its latest process roadmap, including Intel 14A process technology, an evolved version of the specialized node, and new Intel Foundry Advanced System Assembly and Test capabilities to help customers succeed in the AI space.
Intel Foundry Announces New Customers: Microsoft CEO Satya Nadella said that a Microsoft-designed chip is planned to be produced using the Intel 18A process node.
Ecosystem partners such as Synopsys, Cadence, Siemens and ANSYS announced that their verification tools, design flows and IP portfolios are ready to support designs for Intel foundry customers.
Today, Intel announced the launch of Intel Foundry, a more sustainable system-level foundry for the AI era, and expanded its roadmap to establish and strengthen process technology leadership over the next few years. Intel also highlighted the growth momentum of its foundry customers and the increased support from ecosystem partners. Ecosystem partners, including Synopsys, Cadence, Siemens and ANSYS, have confirmed that their tools, design flows and IP portfolios have been validated for Intel's advanced packaging and Intel 18A process technologies to accelerate chip designs for Intel foundry customers.
"AI is profoundly changing the world and the way we think about technology and its 'core' power," said Pat Kissinger, CEO of Intel Corporation. This presents unprecedented opportunities for innovative chip design companies around the world and Intel Foundry, the industry's leading system-level foundry service for the AI era. Intel foundry can work with customers to open up new markets and change the way people use technology to make their lives better. ”
Four years and five nodes".
Intel has expanded its process technology roadmap with the addition of Intel 14A and several specialized node evolutions. Intel also confirmed that its "five-time-to-process roadmap in four years" is still progressing steadily and will be the first in the industry to offer a back-powered solution. Intel expects to regain process leadership by 2025 with the Intel 18A process node.
Intel's new process roadmap includes evolved versions of Intel 3, Intel 18a, and Intel 14a technologies, such as Intel 3-T, which is optimized for 3D advanced packaging designs with through-silicon via technology and will soon be production-ready. Intel also highlighted its progress on mature process nodes, announcing a new 12nm node in January this year in joint development with UMC. Intel Foundry plans to launch a new node every two years and roll out an evolved version of the node along the way to help customers continuously improve their products through Intel's leading process technology.
In addition, Intel Foundry announced the addition of FCBGA 2D+ to Intel Foundry ASAT's technology portfolio. The portfolio will include FCBGA 2D, FCBGA 2D+, EMIB, FoverOS and FoverOS Direct technologies.
Customer milestone: Microsoft becomes a new Intel 18A customer.
Intel's customers have expressed support for Intel system-level foundry. Microsoft Chairman and CEO Satya Nadella announced in a speech at Intel Foundry Direct Connect that Microsoft plans to use the Intel 18A process node to produce one of its chips.
"We are in the midst of a very exciting platform shift that will fundamentally change the productivity of every business and the industry as a whole," said Satya Nadella. To achieve this vision, we need reliable** advanced, high-performance and high-quality semiconductors. That's why Microsoft is excited about partnering with Intel foundry to produce a chip we designed using the Intel 18A process node. ”
Intel foundry has a large number of customer design cases across all generations of process nodes, including Intel 18A, Intel 16, and Intel 3, as well as Intel Foundry ASAT, including advanced packaging.
Overall, Intel foundry has an expected lifetime deal value of more than $15 billion in wafer fabrication and advanced packaging.
IP & EDA** vendors: Prepare for chip designs based on Intel's process and packaging technologies.
IP (Intellectual Property) and EDA (Electronic Design Automation) partners Synopsys, Cadence, Siemens, Ansys, Lorentz and Keysight say the tools and IP are ready to help foundry customers accelerate advanced silicon designs based on the Intel 18A process node, the industry's first back-side power solution. In addition, these partners have confirmed that their EDAs and IP are enabled across Intel's process nodes.
At the same time, for Intel EMIB 25D packaging technology, several leading companies also announced plans to cooperate in the development of assembly technology and design processes. These EDA solutions will enable Intel to develop and deliver advanced packaging solutions to customers faster.
Intel also announced its Emerging Business Initiative, which will work with Arm to provide advanced foundry services for Arm-based system-on-chips (SoCs). This program supports start-ups in the development of ARM-based technologies and provides the necessary IP, manufacturing support, and financial assistance, providing significant opportunities for ARM and Intel to foster innovation and growth.
System-level foundry: Intel foundry's differentiated advantages in the AI era.
Intel's system-level foundry model provides full-stack optimization from the factory network to the software. Intel and its ecosystem deliver evolving technologies, reference designs, and new standards that enable customers to innovate at the entire system level.
"Intel provides industry-leading foundry services and delivers them from resilient, more sustainable and secure sources," said Stuart Pann, senior vice president of foundry at Intel. This complements the company's strong system-on-chip capabilities. Combined, these strengths enable Intel to meet the needs of its customers. For even the most demanding applications, Intel Foundry helps customers develop and deliver solutions. ”
Global, resilient, more sustainable and trustworthy system-level foundry.
When it comes to sustainability, Intel also aims to be a leader in the foundry industry. In 2023, Intel's factories around the world are estimated to be using 99% renewable electricity. At Intel Foundry Direct Connect, Intel reaffirmed its commitment to 100% renewable electricity, water positivity, and zero waste to landfill by 2030. In addition, Intel reaffirmed its commitment to achieve net-zero Scope 1 and Scope 2 greenhouse gas (GHG) emissions by 2040 and net-zero upstream Scope 3 greenhouse gas emissions by 2050.