Oxygen content in the semiconductor manufacturing process is a critical parameter as it can affect the properties of the material, the rate of reaction, and the quality of the product. The MicroX-223 Oxygen Analyzer is a high-precision gas analyzer (capable of measuring oxygen content up to 10 ppm) that is ideal for monitoring oxygen levels in RTA (Rapid Thermal Annealing) furnaces in semiconductor processes.
The following are the steps to monitor oxygen content on a semiconductor RTA rapid annealing furnace using the MicroX-223 Oxygen Analyzer:
Installation and calibration
The MicroX-223 oxygen analyzer is installed at the gas outlet or sampling point of the RTA annealing furnace to ensure that the sensor has direct access to the gases in the furnace process.
Calibrate the oxygen analyzer prior to installation to ensure the accuracy and reliability of its measurements.
2.System Integration:
Integrate the oxygen analyzer with the RTA annealing furnace's control system, usually an automated or PLC system. This can be achieved through a hard-wired connection or network communication (e.g. RS-232, RS-485, Ethernet, etc.).
The integrated oxygen analyzer provides real-time oxygen content data to the control system, which can adjust furnace conditions or trigger alarms.
3.Set alarm and monitoring thresholds:
In the control system, set the alarm threshold for the MicroX-223 oxygen analyzer. When oxygen levels exceed or fall below these thresholds, the system should be able to trigger an alarm to notify the operator to take timely action.
Set monitoring thresholds so that operators and quality control teams can continuously monitor oxygen levels and adjust process parameters or troubleshoot accordingly.
4.Data Logging and Analysis:
Historical data on oxygen content is recorded using a control system or an additional data acquisition system.
Analyze this data to identify process stability, product consistency, and potential process improvements.
5.Maintenance & Calibration:
The MicroX-223 Oxygen Analyzer is regularly maintained and calibrated to ensure its long-term accuracy and reliability.
Develop a maintenance plan based on the manufacturer's recommendations and the requirements of the semiconductor process.
productsFeatures:
Measuring range: 1ppm-25% O2
Reliable zirconia sensor technology
Suitable for harsh environments
Fast response rail mounting
LCD display and 4 multi-function buttons
4-20mA signal output
RS-232 communication protocol
24VDC power supply
3 sets of relay alarms
m18x1.5 threaded process interface