Fast Technology reported on February 26 that Qualcomm today launched the Qualcomm FastConnect 7900 mobile connection system, which is expected to be commercialized in the second half of 2024.
It is the industry's first solution that supports AI-optimized performance and integrates Wi-Fi 7, Bluetooth, and ultra-wideband technologies in a single chip.
According to the official introduction, using AI, FastConnect 7900 can adapt to specific use cases and environments, effectively optimizing energy consumption, network latency, and throughput.
The FastConnect 7900 integrates ultra-wideband technology, Wi-Fi ranging, and Bluetooth channel detection to create a powerful set of proximity sensing technologies that enable a seamless experience for proximity sensing applications such as digital keys, item finding, and indoor navigation.
The FastConnect 7900 features a new level of RF front-end module and next-generation high-frequency concurrency technology to further improve technical performance.
As a key innovation in the Wi-Fi 7 era, high-frequency concurrency technology is the core of the multi-device connected experience, and is also the foundation of Qualcomm's extended personal area network (xpan) and Snapdragon Seamless experience.
"Qualcomm FastConnect 7900 is a technological masterpiece that sets a new benchmark with AI and integrates leading Wi-Fi 7, Bluetooth and ultra-wideband capabilities in a single 6nm chip," said J**ier Del Prado, vice president and general manager of Qualcomm Technologies' Mobile Connectivity business.
With the first generation of Qualcomm Wi-Fi 7 solutions already available in millions of devices, the FastConnect 7900 creates a new way to connect, bringing a new level of AI, proximity sensing, and multi-device connectivity to users' favorite devices.