TDK s Slim POL DC DC DC Converter FS1412

Mondo Technology Updated on 2024-02-08

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POL technology consists of a DC-DC converter placed near complex chipsets such as ASICs and FPGAs. By reducing the distance between the converter and the chipset, resistive and inductive components are minimized, allowing for fast response and precise regulation at dynamic load currents. TDK has been developing this technology for many years to enable system-level solutions to improve electrical and thermal performance, providing a high-density, cost-effective solution for space-constrained applications that require thinner power supplies. These new solutions incorporate high-performance semiconductors into advanced packaging technologies, such as semiconductor embedded substrates (SESUBs) and advanced electronic components, to enable unique system integration in a smaller form factor and thinner form factor through 3D integration. This integration allows the TDK to provide greater efficiency and ease of use at the currently low total system cost.

TDK's FS1412 micropol (POL) power module is based on POL technology, and the size of the FS1412 is 58 mm x 4.9 mm x 1.6 mm, which is part of a new series of POL DC-DC converters with higher performance, smallest available size, ease of use and simplified integration for applications such as big data, machine learning, artificial intelligence (AIG cellular, IoT networking, telecommunications and computer enterprises). The FS1412 has been mass-produced.

The new POL DC-DC converter series can operate over a wide junction temperature range of -40 °C to 125 °C and has a high current density of more than 1000 A per cubic inch. The series offers 12 A with a minimum height of 1 on the market6 mm, while offering 50% less solution size than other comparable products. As a result, this also minimizes the cost of the system solution, reducing the board size and assembly costs as well as the BOM cost and PCB cost.

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