Reel, stick and tray are all common packaging forms for semiconductor chips and components, and they each have some advantages. The features and benefits of these three packaging formats are detailed below.
1.Tape & Reel Packaging:
Tape and reel packaging is to continuously arrange components on a plastic roll shaft at a certain distance and fix them with mylar film with holes. The advantages of tape-and-reel packaging include:
High-density: Components are tightly packed on tape and reel, which can achieve high-density packaging and save space.
Automated production: Tape and reel packaging is suitable for automated production lines, which can achieve fast placement operations and improve production efficiency.
Protect components: Tape and reel packaging can provide good anti-static and mechanical properties, and protect components from damage.
For example, many surface-mount components (SMDs) such as resistors, capacitors, integrated circuits, etc., are often packaged in tape and reel. During the placement process, the automation equipment accurately attaches the components on the tape and reel to the PCB.
2.Stick Packing:
Stick packaging is the arrangement and packaging of components in a straight rod shape. The advantages of stick packaging include:
High reliability: The stick package can provide good mechanical protection and anti-static performance, ensuring the safe transportation and storage of components.
Easy to operate: The stick package is suitable for manual operation, and the engineer can take the required components directly from the stick for easy inspection and repair.
For example, some components such as integrated circuits and sensors with larger sizes are usually packaged in rods. On the production line, the staff can manually remove the required components for the subsequent process.
3.Tray Packing:
Tray packaging is the placement of components in dedicated plastic or metal trays, each with multiple fixed positions for the components. The advantages of pallet packaging include:
Easy to manage: Tray packaging makes components neatly arranged and easy to manage and identify.
Reuse: Pallets can be reused, reducing packaging waste and saving resources.
Anti-static protection: Tray packaging usually has good anti-static properties to protect components from static damage.
For example, some large-size, heavy-weight components such as power modules and high-power transistors are often packaged in trays. On the production line, the operator can easily remove the components on the tray for subsequent process steps.
It is important to note that choosing the appropriate packaging form depends on factors such as the characteristics of the component, its size, production needs, and the transportation and storage environment.