United StatesSemiconductorsThe industry once enjoyed a clear technological advantage and was in a leading position in the field of chip manufacturing and design. However, with Chinese mainlandSemiconductorsWith the rapid development of the industry, the United States felt threatened and accelerated the containment of ChinaSemiconductorsThe pace of development. They are trying to delay other countries by means of some "violations".SemiconductorsThe speed of development of the industry. This mentality of not admitting defeat is precisely what has prompted the United States to intensify its efforts to contain ChinaSemiconductorsThe reason for the industry. With the globeSemiconductorsThe pattern changes, and all countries will build their own territoriesSemiconductors** Chain as an important goal, large-scale investment in localSemiconductorsIndustry support, ChinaSemiconductorsThe speed of the rise has forced the United States to re-examine the situation. According to a report released by CSET, the construction speed of US fabs is almost the slowest in the world, while Chinese mainland is in the process of catching up at a high speed. Despite ChinaSemiconductorsThere is still a gap with the United States in cutting-edge technology, but its rapid development momentum is worthy of vigilance. CSET calls for the United States to be homegrownSemiconductorsThe industry has given the "green light" to simplify cumbersome regulations and increase the speed of construction. However, the speed of wafer factory construction in the United States has been slow, according to relevant data, the construction speed of the United States is only slightly better than that of Southeast Asia, and it lags significantly behind countries such as Japan. The United States is in a difficult situation because subsidies have not been paid for a long time. In the context of the struggle for global chip manufacturing supremacy, the United States has formulated more than $50 billion in chip incentive policies to attract more cutting-edge chip manufacturers to set up factories in the United States. However, due to the fact that the subsidy was not disbursed in time,IntelSamsungand TSMC have announced plans to postpone factory operations. At the same time, Japan's TSMC announced the construction of a second chip factory, highlighting the impact of the lagging US subsidy policy. Bottlenecks in the United States, such as obstacles and environmental challenges, could be a serious obstacle to the United StatesSemiconductorsThe development of the industry. Therefore, the call of the CSET is particularly urgent, and the United States urgently needs to accelerate its homelandSemiconductorsThe pace of construction.
United StatesSemiconductorsThe industry used to be globalTechnologyLeader, but with the globalSemiconductorsThe pattern has changed, and the technological superiority of the United States has gradually been challenged. In the context of the rapid development of Chinese mainland and other countries, the United States has increased its targeting of the mainlandSemiconductorsThe strength of the industry's support. However, compared to other countries, the United States faces a number of difficulties. The construction speed of wafer fabs in the United States has been slow, and there is a significant gap compared with countries such as Japan. The subsidy policy was delayed, resulting inIntelSamsungand TSMC and others plan to delay factory operations. In addition, there is a complex and cumbersome situation in the United StatesSemiconductorsIt is difficult to revise the relevant regulations in a short period of time, and it is difficult for the situation to improve quickly. All kinds of difficulties make the United StatesSemiconductorsThe industry is gradually losing its dominant position in global competition, and it is urgent to accelerate localizationSemiconductorsThe pace of construction to cope with the intenseMarket competition
Under the plight of the United States, Chinese mainlandSemiconductorsThe rise of the industry is unstoppable. With China inSemiconductorsHuge sums of money have been invested in the field and continue to increase R&D efforts in ChinaSemiconductorsTechnology is constantly catching up, and the speed of development is remarkable. Although China still has a certain gap in cutting-edge technology, its momentum is unsettling for the United States. The United States should take this as a warning and accelerate its homelandSemiconductorsconstruction, optimize relevant regulations and subsidy policies, in order to maintain competitiveness in global competition.
CSET stressed that the United States should be homegrownSemiconductorsThe industry "gave the green light", simplified the construction procedures, and accelerated the construction speed. However, the United StatesSemiconductorsBottlenecks within the industry make it difficult to realize this call quickly. The construction of wafer fabs in the United States has been slow for a long time, and it needs to face increasingly fierce global competition. The delay in the issuance of subsidies has also affected the development of the entire industrial chain. At the same time, the United States has become constrained by various cumbersome regulations and approval proceduresSemiconductorsAn important factor in the development of the industry. In this context, CSET's appeal is significant, but it is still difficult to achieve immediate results. United StatesSemiconductorsThe industry needs to fundamentally examine the problem and move forwardSemiconductorsIndustrial upgrading to adapt to the new situation of global competition.
InSemiconductorsIn the competition of industries, the competition between the United States and China and other countries will become more intense. The U.S. needs to accelerate its homelandSemiconductorsOnly by optimizing the policy environment and improving the speed and technical level of industrial construction can we occupy a place in global competition. ChinaSemiconductorsThe industry should continue to increase R&D investment, improve independent innovation capabilities, and continue to shrink withInternationalThe gap between the advanced level and the competitive advantage. Global presenceSemiconductorsThe huge opportunities and challenges of the market should be jointly promoted by all countries in line with the principle of win-win cooperationSemiconductorsThe development of the industry to achieve common prosperity.
This article ** The United States and Chinese mainland inSemiconductorsCompetitive situation in industrial development. The United States faces difficulties such as slow construction and lagging subsidy policies, while Chinese mainlandSemiconductorsThe rapid development of the industry is remarkable. GloballySemiconductorsAgainst the backdrop of fierce competition, the United States should take this as a warning and accelerate its own effortsSemiconductorsconstruction, optimize the policy environment, and improve the technical level. Chinese mainland should continue to increase R&D investment, enhance independent innovation capabilities, and maintain competitive advantages. Win-win cooperation is the key to achieving common prosperity, and we hope that all countries can work together to promote itSemiconductorsThe development of the industry creates a better future.