The thick film process refers to the thickness of a few microns to tens of microns formed on a substrate by printing and sintering technology. We usually divide the metal film formed on the substrate into thin film hybrid integrated circuits and thick film hybrid integrated circuits.
The components made of thin-film hybrid integrated circuits have high parameter accuracy, good temperature and frequency characteristics, and can work in the millimeter wave band, but the process equipment used is relatively expensive and the production cost is high. The disadvantage is that due to the thickness of the film, the power it carries is too small, and the adhesion of the coating is usually worse when it exceeds 200, which is not suitable for high-temperature use.
Thick film hybrid is an integrated circuit made by combining a semiconductor integration process with a thick film process. Thick-film hybrid integrated circuits are made of thick-film elements and their interconnection lines by film-forming method on the substrate, and discrete semiconductor chips, single-chip integrated circuit chips, and passive devices are mixed and assembled on the same substrate, and then packaged.
Thick film hybrid is an integrated circuit made by combining a semiconductor integration process with a thick film process. Thick-film hybrid integrated circuits are made of thick-film elements and their interconnection lines by film-forming method on the substrate, and discrete semiconductor chips, single-chip integrated circuit chips, and passive devices are mixed and assembled on the same substrate, and then packaged.
Compared with discrete component circuits, hybrid integrated circuits have the characteristics of high assembly density, high reliability, and good electrical properties. For monolithic integrated circuits, it has flexible design and convenient process, which is convenient for multi-variety and low-volume production. Compared with thin-film circuits, thick-film circuits can withstand higher voltages, higher powers, higher currents, and higher temperatures, making them more suitable for high-temperature applications.
Compared with discrete component circuits, hybrid integrated circuits have the characteristics of high assembly density, high reliability, and good electrical properties. For monolithic integrated circuits, it has flexible design and convenient process, which is convenient for multi-variety and low-volume production. Compared with thin-film circuits, thick-film circuits can withstand higher voltages, higher powers, higher currents, and higher temperatures, making them more suitable for high-temperature applications.
Thick-film hybrid integrated circuits fundamentally solve the three important quality risks encountered in the operation of the instrument while drilling from the implementation principle and physical structure: high-temperature failure of electronic devices, failure of electrical connection, and insufficient seismic ability of the circuit.
Compared with traditional high-temperature PCB solutions, Zhiteng's high-temperature thick-film hybrid integrated circuits have the following advantages:
1.Fewer solder joints, gold wire bonding, stable reliability, not easy to fall off;
2.The integrated structure of skeleton circuit, the thermal expansion coefficient is close to that of warping, and there is no warping deformation;
3.Sintered sealed connectors, flexible connection, no risk of failure;
4.High thermal conductivity efficiency, fast heat dissipation of power components;
5.Airtight packaging, suitable for operation in the salt spray environment at sea, not easy to be corroded;
6.Modular assembly, on-site operation to shorten maintenance time;
7.It has good confidentiality and is difficult to imitate and crack.