The semiconductor industry has long been considered the "crown jewel" of the technology sector, where technological innovation and resource control have always been the focus of competition between countries. In recent years, as domestic chips have made certain breakthroughs in the field of semiconductors, discussions about the rise of Chinese chips at home and abroad have also heated up. However, there are key data hidden behind it, revealing some practical bottlenecks in the development of domestic chips. This article will deeply analyze the current situation of domestic semiconductor independent research and development, the controversy of "exaggeration" of domestic chips, and put forward thoughts and prospects for future development.
Although domestic chips have made some progress in 7nm chips, key data show that there is still a serious dependence on imports in the field of semiconductor manufacturing. With a self-sufficiency rate of only 10%, China still needs to rely heavily on imported raw materials, especially in the field of key materials such as silicon wafers, electronic special gases, and photoresists. At the same time, compared with foreign countries, there is also an obvious gap in process technology. The silicon wafer process of most domestic manufacturers is still stuck at 300nm, and the market share is low. In addition, materials such as photoresists are used more in the 90nm process, while the more advanced 65nm process is only a handful. These data reveal the bottlenecks and challenges in the development of domestic chips, so that there is still a big gap in the strength of domestic semiconductors to replace foreign semiconductors.
Although there have been some successes in the domestic semiconductor field, especially in the manufacture of 7nm chips, this does not mean that domestic chips have truly achieved comprehensive independent research and development and production. Key data show that China still faces serious raw material dependence problems in the semiconductor manufacturing process. The reality of less than 10% self-sufficiency makes us realize that even behind some achievements, there are still important shortcomings that need to be filled. In the field of key materials such as silicon wafers, electronic special gases, and photoresists, China is still unable to achieve self-sufficiency, and still needs to rely heavily on imports. In addition, the development of domestic manufacturers in process technology is also relatively lagging behind, and most of them are still stuck in relatively backward processes, and there is an obvious gap compared with foreign giants. Wafer manufacturing is limited to 300nm and has a limited market share; In terms of photoresist and other materials, the 90nm process is mainly used in China, while the more advanced 65nm process is only a few manufacturers in the trial verification stage. The disclosure of these data reveals the weak links and practical challenges in the development of domestic chips, and there is still a long way to go and many difficulties to overcome if China wants to replace the status of foreign semiconductors.
The characteristics of the domestic semiconductor market determine that the field of semiconductor raw materials is not optimistic, and the high investment and high risk make most manufacturers reluctant to get involved. In contrast, areas such as chip design have higher profit margins and market attractiveness, so most companies are more inclined to research and invest in this field. As a result, the R&D strength of semiconductor raw materials is relatively weak, and the self-sufficiency rate has been slow to increase. In addition, there are many types of semiconductor raw materials, and different types of materials need to correspond to different R&D technologies and production processes, making comprehensive coverage a difficult task. The superposition of multiple factors such as technical barriers, R&D investment, and market prospects makes it difficult for domestic manufacturers to make major breakthroughs in the field of semiconductor raw materials, and the road to improving self-sufficiency is still full of challenges.
The unique business environment of the domestic semiconductor market determines that the field of semiconductor raw materials is not regarded as a hot spot for investment. High upfront R&D investment and uncertain market returns make most companies take a wait-and-see attitude in this field. In contrast, chip design and other fields have a larger market space and a shorter R&D cycle, so they are more favored by enterprises. This has led to a relatively weak R&D capability in the field of semiconductor raw materials, and the pace of self-sufficiency improvement has been slow. In addition, there are many types of semiconductor raw materials, and different types of materials require different R&D technologies and production processes, making comprehensive coverage a difficult challenge. Multiple factors such as technical thresholds, R&D costs, and market prospects are intertwined, resulting in difficulties for domestic manufacturers to innovate and break through in the field of semiconductor raw materials, and the road to improving self-sufficiency is still full of arduous challenges.
To make up for the shortcomings in the production of semiconductor materials, it is a difficult challenge for the domestic semiconductor industry. Large-scale investment and technological innovation are the keys to achieving breakthroughs in a short period of time, but the enthusiasm and investment of enterprises alone are far from enough. **The guidance and support of policies, the active promotion of industry cooperation, and the cultivation of talent teams all need to be fully forced. At the same time, strengthening international cooperation and experience reference, with the help of foreign advanced technology and experience, will also play a positive role in promoting the future development of the domestic semiconductor industry. In the face of the great changes and challenges in the domestic and foreign market environment, only by truly realizing its own shortcomings and problems and formulating a scientific and reasonable development strategy can domestic chips make great progress in cutting-edge technology and market competition.
In order to make up for the domestic shortcomings in the field of semiconductor material production, the collective efforts of the domestic semiconductor industry are needed. Large-scale investment and technological innovation are the foundation for breakthroughs, but corporate enthusiasm and investment alone are not enough. ** policy guidance and support, cooperation between industries, and the cultivation of talent teams all need to be coordinated. At the same time, strengthening cooperation and exchanges with the international market and learning from foreign advanced experience and technology is very important for the development of the domestic semiconductor industry. In the face of the ever-changing market environment and fierce competition, domestic chips must face up to their own problems and shortcomings, and formulate scientific and effective strategic planning in order to make real breakthroughs and progress in technology leadership and market competition.
Domestic chips have made some progress in recent years, but there are still many challenges to achieve true independent R&D and production. Problems such as dependence on imports in the field of semiconductor raw materials, the lag of process technology, and the uncertainty of market size make the development of domestic chips still full of difficulties and challenges. In the future development, China should increase investment, strengthen cooperation, strive to make up for shortcomings, and enhance independent innovation capabilities, in order to win a greater competitive advantage in the global semiconductor market. For the development prospects of domestic chips, it is necessary to have a clear understanding and strategic planning for a rainy day in order to achieve rapid development and growth.