It's so ruthless! Xiang Ligang: TSMC continues to upgrade the chip manufacturing process, shocking**?
The article is original and is forbidden to be copied, otherwise you will be held responsible.
In the past few years, the mainstream 7nm and 5nm in the market are now 3nm, while TSMC, Samsung and other companies may achieve large-scale production of 2nm in 2025.
In the face of this huge technological progress, those customers who strive for excellence in manufacturing technology are naturally eager to do so, and the United States has also frequently revised relevant regulations to include more high-end manufacturing technologies in the scope of control. But can chip manufacturing technology lead to huge advances? Chips below 7 nm need an EUV lithography machine to produce?
In this regard, Xiang Ligang, a well-known communication scholar, once said: TSMC continues to improve the chip process, which is an amazing **!
Compete for cutting-edge technology.
7nm is a hurdle, 6nm and 5nm are the most advanced technologies, and 10nm and 14nm are the most advanced technologies. As for processes above 7 nm, it is generally assumed that only ASML's EUV lithography machine can produce it.
The main reason is that the United States and other European and American countries have strictly controlled the supply of EUV lithography machines, and there is currently no EUV lithography equipment in China, so it is very difficult to manufacture chips at 7 nm and below. With the passage of time, more and more people believe that EUV lithography machines are an indispensable part of manufacturing high-end chips, which is also an unspoken rule in the industry.
This is not a strange thing, a good device can greatly improve the yield rate of the product. Therefore, once TSMC and Samsung began to experiment with the 2nm process, the current EUV lithography could no longer meet the demand, and more precision instruments were needed to manufacture it.
ASML has come up with the latest generation of EUV lithography machine, which costs as much as 2.7 billion yuan and weighs 150 tons, which is not only expensive, but also priceless. Even so, there is still a shortage of high-resolution NA EUV lithography machines, with only 10-20 units on order.
Of course, it is impossible for China to produce high-NA EUV lithography machines, does this mean that we have lost the competition in high-end processes? Xiang Ligang's words made him wake up like a dream.
Xiang Ligang debunked the fraud.
Xiang Ligang pointed out that what TSMC has done has had a great impact on the entire semiconductor industry, and they feel that if they want to improve the process level to 7 nm, they need a very advanced EUV lithography machine, which is a good way to develop and a means to restrict China's development.
Xiang Ligang also pointed out that TSMC's process upgrade is actually a farce, and he also cited the report that China will mass produce 5-nanometer chips, how can this be achieved if China does not use extreme ultraviolet lithography machines?
It can be seen from Xiang Ligang's words that lithography machines above 7 nm do not necessarily have to use EUV, and the 5 nm and 3 nm processes mentioned by TSMC are simply a complete lie.
Xiang Ligang put the responsibility on TSMC, although TSMC is developing 5 nm and 3 nm processes, they can completely produce products that meet market needs through DUV lithography machines. Is the lie exposed by Xiang Ligang really true?
Huawei launched the Kirin 9000 and was a huge hit on the Mate60, while the processor of the Kirin 9000 was produced in China without the use of American and EUV lithography. However, the smoothness of the Kirin 9000 is not inferior to TSMC's 5 nm process.
It may not be long before China will use the current technology to realize its dreams.
If you agree, you can like it, pass it on again, comment on it, and share it.