One day, I took a taxi
Met a master
From Tiannan to Haibei, from professional to professional
At the end of the conversation, under the recommendation of the driver's master
I bought a PCB encyclopedia for 88
Today I will bring you this encyclopedia of PCB plate classification!
"Introduction to the Classification and Characteristics of PCB Plates".
In the manufacturing process of PCB (Printed Circuit Board), the board is the base material of the PCB.
PCB board is also called copper clad laminate, according to different application needs, copper clad laminate uses different basic materials, the following is an introduction to the characteristics and application fields of different types of materials.
What is CCL?
The general expression in the industry is: copper clad laminate (full name copper clad laminate, English abbreviation CCL), is a product made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, single-sided or double-sided covered with copper foil, and hot-pressed.
It can be simply summarized as: a circuit board base material made by hot pressing by covering copper foil on one or both sides of different insulating plates.
Most of the main materials of copper clad laminates can be divided into three types:
1. Reinforcement materials, play the role of physical mechanism and strength support;
2. Adhesive, which plays the role of bonding multi-layer reinforcing materials and copper foil and insulation;
3. Copper foil, which provides materials for circuit boards to make conductor circuits.
PCB board classification - rigid copper clad laminates
1. Paper substrate
Structure:
2. Composite substrate
Structure:
a/
b/
3. Fiberglass substrate
Structure:
4. Metal substrate
Structure:
5. High-frequency board
Note: The main categories of ceramic materials are: alumina (Al2O3), aluminum nitride (ALN), silicon nitride (Si3N4), and beryllium oxide (BEO).
The mainstream processing technology of ceramic substrate includes: HTCC high-temperature co-fired ceramics, LTCC low-temperature co-fired ceramics, DBC direct copper plication, DPC direct copper plating, and AMB active metal brazing. Different substrates have their own advantages in terms of performance.
The expansion coefficient of PTFE substrates with ceramic filler is greatly reduced, and the machinability and electrical properties are improved.
Structure:a/b/
Flexible copper clad laminates
1. Flexible board
Structure:
This article guides the experts: