Multilayer PCB board In the field of PCBA chip processing, the lamination process of PCB multilayer board is a crucial link. This process is not only related to the structural stability of the multilayer board, but also has a direct impact on its electrical performance and reliability. Below, we will delve into the details of the PCB multilayer board lamination process from several key aspects.
Before starting lamination, the inner laminates must be rigorously inspected and treated. This includes ensuring that the surface of the inner layer is clean and free of oxides and oils, as well as micro-etching necessary to enhance interlayer adhesion. At the same time, the positioning holes and alignment marks of the inner layer need to be precisely made to ensure precise alignment in the subsequent lamination process.
Laminated materials, such as prepreg and copper foil, are the core elements of the multilayer lamination process. The selection of prepreg should be based on the performance indicators such as dielectric constant, thickness tolerance and heat resistance required by the design. The thickness and type of copper foil (e.g., electrolytic or rolled copper foil) can also affect the final performance of the multilayer board.
Lamination parameters, including temperature, pressure, and time, are key to ensuring the quality of the lamination. Temperatures that are too high or too low can cause the prepreg to be incompletely cured or over-cured, which can affect the electrical properties and mechanical strength of the multilayer board. Similarly, the setting of pressure and time needs to be precisely controlled to ensure good bonding between the layers and even distribution of the prepreg.
During the lamination process, it is essential to implement strict quality control measures. This includes real-time monitoring of temperature and pressure changes in the laminator, as well as regular checks on the thickness, flatness, and appearance quality of the laminated multi-layer panels. Any deviation from the standard needs to be adjusted and dealt with in a timely manner to ensure the consistency and reliability of the multi-layer board.
Once laminated, the multi-layer panels go through a series of post-processing processes such as cooling, cutting, and drilling. These processes also need to be precisely controlled to avoid introducing new quality problems. Ultimately, multilayer boards need to pass rigorous electrical and mechanical testing to ensure they meet design requirements and application requirements.
The lamination process of PCB multilayer boards is a complex and delicate process that involves several key links and many influencing factors. Only by implementing strict quality control and management at every step can we ensure that the final multilayer board has excellent electrical properties, mechanical strength and reliability.