Hotspot Engine Project Google is working on a new Tensor G4 chip that will be used in the Pixel 9 series phones coming out next year. According to Korean media FNN, this chip will be foundry by Samsung and will use Samsung's 4nm third-generation SF4P process, which is the same as Samsung's Exynos 2400 chip. This process uses FOWLP (Fan-Out Wafer-Level Packaging) technology, which can improve the performance and efficiency of the chip, reducing heat generation and size.
FOWLP technology is an advanced packaging technology that can add more IO connection points around the chip, thereby increasing the interconnect density and data transfer speed of the chip. At the same time, FOWLP technology can also improve the heat dissipation performance of the chip, as it can reduce the size and thickness of the chip, thereby improving the heat transfer efficiency.
Samsung's Exynos 2400 chip is Samsung's first smartphone chip with FOWLP technology, and it is also Samsung's first chip based on AMD's RDNA architecture's Xclipse 940 GPU. The chip has been used in Samsung's Galaxy S24 and Galaxy S24+ series phones, and has demonstrated excellent performance and efficiency.
Google's Tensor G4 chip will use the same 2400nm SF4P process as the Exynos 4 chip, but it may have different CPU and GPU configurations. As previously reported, the Tensor G4 chip will feature Google's self-designed GPU, as well as a similar combination of CPU cores to the Tensor G3 chip. The Tensor G3 chip is Google's first in-house designed chip, which has been used in the Pixel 8 series of phones, with a strong emphasis on machine learning and image processing capabilities.
Google's Pixel 9 series phones are expected to be released in the second half of 2024 and will be powered by the Tensor G4 chip, giving users faster speeds and a better experience. Google's Pixel series phones have always been praised for their excellent camera and software optimizations, and the addition of the Tensor G4 chip may also give the Pixel 9 series a breakthrough in terms of performance.
Information**
1 구글g4 칩 2400과 동fnn1
2 fan-out wafer level packaging: breakthrough advantages and surmountable challenges. semiconductor digest
3 so what is fowlp and its applications? simcenter.
4 exynos 2400 is samsung’s first smartphone chipset to adopt fowlp technology. wccftech
5 exynos 2400 could use samsung’s new tech for improved thermals and performance. sammobile
6 possible google pixel 9 spotted running new tensor g4 chip. t3
7 google tensor g4 reportedly runs geekbench 5. gsmarena.com
8 what is google’s tensor chip? everything you need to know. android authority.