"After Liang Mengsong joined SMIC, is Samsung's chip technology becoming more and more unbearable? ! "！
At present, only TSMC and Samsung have 3 nm process technology in the world.
Although they are both 3 nm processes, one is in the sky and the other is on the ground. The 3 nm process will account for 6% and 15% of TSMC's revenue in the third and fourth quarters of fiscal 2023, which is an important part of TSMC's revenue.
What is the concept of Samsung? At the moment, it seems that Apple has no customers, not even its own Exynos processors, while Samsung uses a 4nm process instead of a 3nm process.
Industry insiders said that due to the extremely poor yield of Samsung's 3 nm process, there will be no manufacturers to use it at all, let alone manufacturers to use it. In other words, Samsung's reputation on the 3 nm process is too sloppy to be used at all.
Unfortunately, after Samsung released the 14nm FinFET process and TSMC's 16nm process in 2015, Samsung's 14nm process has a leading position in TSMC's 16nm process.
Samsung, on the other hand, got a new chip together with TSMC, while TSMC uses 14-nanometer chips, while Samsung's chips are 16-nanometer chips.
Samsung's progress in the 14nm FinFET process is thanks to a man named Liang Mengsong. Before leaving, he was a key engineer at TSMC before leaving because he was dissatisfied with the company, and then joined Samsung.
Before 14 nm, the entire industry was using the MOSFET process, and companies such as TSMC have also moved to 20 nm, while Samsung is still using 28 nm.
Now Liang is pushing Samsung to move from 28nm to 14nm to more advanced FinFET devices, starting with 20nm.
Samsung, with the help of Liang Mansong, advanced 28 nm to 14 nm, and then abandoned 20 nm and started the history of Finfet.
At the end of 2014, Samsung's 14 nm FinFET process was officially put into production, and in 2015, it was officially put into production, which shocked both TSMC and UMC, while TSMC wanted to upgrade the process before the 16 nm FinFET process was eliminated, so it was a big step behind Samsung.
After that, Samsung launched 10 nm and 7 nm processes, vowing to catch up with TSMC.
Liang joined SMIC in 2017.
Then, SMIC quickly conquered 14nm FinFETs, while Samsung quickly conquered 5nm despite the loss of its big brother Liang Mengsong, and successfully conquered the 3nm process by 2022, although the process is still improving.
But in fact, after the 7 nm process, its performance is not ideal, the representative product of the 7 nm process is the Snapdragon 888, and the 5 nm process is criticized for low production capacity.
I can also take out a **, in the 7 nm era, the chip density of TSMC and Samsung chips is about the same, which is 097 and 095, and Liang Mengsong is still three stars.
But at 5 nm, the distance between the chips becomes farther away, and at 3 nm, the distance between the chips becomes very far. The 3 nm Samsung can only be compared with the 5 nm TSMC, and everyone knows that the 3 nm 3 nm technology will not play any role at all.
Therefore, core technical personnel are very important for a business. With the addition of Liang Mengsong, SMIC quickly completed the repair work of the 14 nm process and tested the 7 nm process. The same is true for SMIC's R&D progress. Because of the limitations of the equipment, I will not repeat it.
In fact, we are confident enough, if SMIC is not pressed by TSMC, Samsung and other giants, then EUV lithography machines can be purchased independently and achieve 3 nm, what do you think?