The application of plasma technology in circuit board cleaning is mainly reflected in the following aspects:
First, the surface of the circuit board is cleaned with the high reactivity of plasma. Charged particles such as ions, electrons, and free radicals in the plasma accelerate under the action of an electric field, bombarding the surface of the circuit board, and undergoing physical and chemical reactions with the pollutants on the surface. These reactions remove contaminants such as organics, oxides, and metal ions from the surface of the circuit board for cleaning purposes.
Secondly, the plasma cleaning technology also has an activation effect. During the cleaning process, the active particles of the plasma can change the microstructure of the surface of the circuit board, increase the reactivity of the surface, make it easier to chemically bond with the materials in the subsequent process, and improve the reliability and stability of the circuit board.
In addition, plasma cleaning technology can also modify the surface of the circuit board. For example, when dealing with flexible printed circuit boards (FPCs), plasma can remove organic matter and dirt from the surface of FPC, while improving the wettability and adhesion properties of the surface, providing better conditions for subsequent painting, printing, soldering and other processes.
In specific applications, circuit board vacuum plasma cleaners usually place the circuit board in a vacuum chamber and excite the working gas to form plasma by a high-frequency electric field or other means. Then, the physical and chemical properties of the plasma are used to clean and modify the surface of the circuit board. The entire process can be completed in a few minutes to tens of minutes, and the cleaning effect is remarkable, and there is no damage to the circuit board.