Intel's 1nm production time**, technology ahead of TSMC!
According to Tom'On February 28, Intel announced that the previously unannounced Intel 10A (1nm) process node will be in production by the end of 2027, and the Intel 14 node will be in production in 2026.
a "Representing Angstroms, 10 Angstroms is equivalent to 1 nanometer (1 nm). This means that Intel 10A is Intel's first 1nm node.
Last week, the magazine "Core IoT" published a detailed report on the technology node roadmap announced by Intel some time ago (heavy!). Microsoft ARM and Intel cooperate on kernel construction, OpenAI CEO talks about artificial intelligence computing needs, and Intel's 14A process technology is announced for the first time). Intel didn't directly give a specific production timeline for the Intel 14a node, but it didn't mention the Intel 10a either.
Intel 14A will be Intel's first process technology to use high-nano EUV lithography technology. In comparison, according to TSMC's previous roadmap, 1The rollout of the 4nm A14-class process is expected to be completed in 2027-2028, while the development of the 1nm A10-class process with High-Na EUV will be completed around 2030.
If Intel's foundry business can achieve its plans in time, it will regain its technology leadership in the key 1nm node, overtaking TSMC.
Keevan Esfarjani, executive vice president and global chief operating officer of Intel Corporation, gave an informative presentation on the roadmap for the next few years.
The graph on the left shows Intel's WSPWs (wafers produced per week) by process node, with no annotations on the Y-axis. This graph provides a direct insight into Intel's production.
Intel did not provide details about the Intel 10A 1nm node, but said that the new node will bring at least double-digit power and performance improvements.
According to Intel CEO Pat Kissinger, the performance of the new node is improved by about 14-15%, and the performance of the Intel 10A node is at least comparable to that of the Intel 14A node. (For example, there is a 15% improvement between Intel 7 and Intel 4).
With the transition to EUV-enabled process nodes, Intel will steadily reduce overall production of 14nm, 10nm, Intel 7nm, and 12nm nodes.
Intel also intends to aggressively expand its advanced packaging capabilities in Phobelos, EMIB, SIP, and HBI (Hybrid Bonded Interconnect). Expanding packaging capabilities is key to addressing the current shortage of AI accelerators. The capacity expansion will ensure the stability of advanced processors in advanced packaging, including HBM**.
The company completed all the in-house packaging work using standard packaging some time ago and is now fully transitioning to premium packaging and will use OSAT, an assembly and testing contractor, for standard packaging work.
This diagram shows how Intel is moving to an external foundry, which will allow the company to increase production per node and extend production time at each node for customer orders. In the long term, this will enable the company to increase production per node and production time per node of customer orders, maximizing margins on its fab and hardware support.
Mr. Esfarjani also spoke about Intel's global activities. In addition to existing facilities, Intel plans to invest $100 billion over the next five years to expand and build new production facilities.
Intel will share several manufacturing facilities for node production: Intel 18a will be located in factories 52 and 62 in Arizona. Hightower Semiconductor's advanced packaging and 65nm wafer fabrication will be located at Fabs 9 and 11X in New Mexico.
The company has not revealed where the Intel 10a will be manufactured, but is expanding production in Ohio, Israel, Germany, Malaysia and Poland.
Intel also intends to build fully autonomous AI factories in the future, and plans to apply AI to all aspects of the production process, from capacity planning and ** to improving productivity and actual production operations, for example'Ten moon landings'。
Esfarjani did not give"Lunar program"but noted that the plan will affect all aspects of the company's future operations. This includes the introduction of artificial intelligence"Collaborative robots"(cobots) – collaborative robots that can work side-by-side with humans – and the widespread introduction of robotic automation in production processes.
Thorstoms hardware.