Today, with the rapid development of the new energy vehicle industry, the demand for high-voltage and high-power IGBT modules is increasing. The technical requirements in this field are extremely high, involving many aspects such as heat dissipation performance, reliability and current carrying capacity of packaging materials. It is in this context that the importance of ceramic copper clad substrates is highlighted, and it has become an indispensable key basic material for power module packaging in the field of power electronics.
The ALN ceramic substrate acts as the carrier body of the chip, effectively isolating the chip from the module heat dissipation baseplate. The ALN ceramic layer in the middle can not only effectively improve the insulation capacity of the module, but also the insulation withstand voltage can exceed 25kV, and has good thermal conductivity, thermal conductivity as high as 170-260W m·k. These superior properties make aluminum nitride copper clad laminates the first choice for high-voltage IGBT module packaging.
It is worth mentioning that the coefficient of thermal expansion of ALN ceramic substrates is similar to that of silicon, which means that it does not cause stress damage to the chip. In addition, aluminum nitride ceramic substrates have a peel resistance of more than 20 mm 2, excellent mechanical properties and corrosion resistance, do not undergo deformation, and can be used over a wide temperature range. These features all contribute to the reliability of the high-voltage IGBT module.
In the automotive field, the application prospect of aluminum nitride ceramic substrate is broader. Taking automotive LED headlights as an example, their operating temperature is extremely high, and if they cannot dissipate heat in time, it will lead to accelerated brightness attenuation. The high thermal conductivity, excellent insulation, and thermal expansion technology that is more compatible with the lamp beads make the aluminum nitride ceramic substrate an ideal choice for high-power headlights. Not only that, the application of aluminum nitride ceramic substrates in automobiles also includes various sensors and various high-power modules of smart cars, which provides strong support for the development of the new energy vehicle industry.
In short, with the continuous development of the new energy vehicle industry, the demand for high-voltage and high-power IGBT modules is becoming more and more urgent. Ceramic copper-clad substrates, especially ALN ceramic substrates, have become important materials in this field due to their excellent properties. In the future, with the further improvement of new energy vehicle technology, the application prospect of aluminum nitride ceramic substrate will be broader, and it will play a greater role in promoting the development of the industry.