Jiufengshan Laboratory recently announced that the world's first 8-inch silicon photonic thin film lithium niobate optoelectronic integrated wafer has recently rolled off the production line. This achievement uses 8-inch SOI silicon photonic wafers to bond 8-inch lithium niobate wafers, and monolithically integrates photoelectric transceiver functions, which is currently the world's advanced technology for silicon-based compound optoelectronic integration. This achievement can realize the large-scale manufacturing of high-end optical chips with ultra-low loss and ultra-high bandwidth. This achievement was developed by Jiufengshan Laboratory and important industrial partners, and will be commercialized as soon as possible. (AI Core World).
Recently, Huang Chongren, chairman of PSMC, announced at the ** exchange meeting that 2024 will be the year of the company's operational transformation. The core of this transformation strategy is to gradually withdraw from competition in the field of panel driver ICs and sensors to avoid fierce competition with Chinese mainland manufacturers. Huang Chongren said that this transformation is not only to avoid market pressure in Chinese mainland, but also a necessary choice for the company to seek long-term development. PSMC has storage technology and is the first company that can stack CPU logic chips with memory chips, and the stacking technology will not lose to TSMC. In addition, Xie Zaiju, general manager of PSMC, revealed that the demand for post-holiday storage foundry and mature process logic foundry customers is urgent. (China Times News Network).
Samsung will begin testing the "digital twin" technology of Nvidia's Omniverse platform to improve the yield of the chip manufacturing process and close the gap with TSMC, according to a report from eToday. Digital twin technology creates a virtual replica of the real world, then uses artificial intelligence (AI) and big data to analyze potential problems. If this technology is applied to chip factories, product defects can be significantly reduced. (Science and Technology Innovation Board**).
China's lithography machine imports to the Netherlands: a year-on-year increase of 1838%, the top three imports from Shanghai, Hubei and Beijing;
2. Institutions: Global semiconductor revenue is expected to increase by 17% to $600 billion in 2024;
3. It is reported that Nvidia H200 B100 chip orders are strong, and TSMC's 3 4nm production capacity is close to full load;
4. Hubei: plans to set up an optoelectronic information industry, with a total scale of 10 billion yuan;
5. Changdian Technology: Subsidiary to 6US$2.4 billion acquisition of 80% stake in Shengdi Semiconductor;
6. Agency: HBM3E competition intensifies, and Korean manufacturers will still occupy 92% of HBM's share in 2024.