With the wide application of electronic products, the reliability of electronic products has become a prominent problem. Most applications require electronic products to operate stably, reliably and safely. In the fields of aviation, aerospace, military, communications, finance, and surveillance, the failure and failure of electronic systems may cause huge losses.
Because electronic products are composed of complex types of electronic components, PCB circuit boards, solder, accessories and software, the reliability of electronic products and systems is particularly complex. From the perspective of electronic product manufacturing, electronic manufacturing can be divided into 4 levels, that is, level 0 of electronic manufacturing (semiconductor manufacturing level (PCB design and manufacturing, IC packaging, passive device manufacturing, process materials and other mechanical and electrical components manufacturing level (electronic product board assembly level (electronic product assembly level). Corresponding to the 4-layer classification, the reliability of electronic products can also be divided into 4 aspects, corresponding to the system-level reliability of electronic products, corresponding to the board-level process reliability, that is, the reliability of the surface assembly process, corresponding to the packaging, components and process materials is the reliability of components, and corresponding to semiconductor manufacturing is the reliability of semiconductor process.
Design for reliability of electronic assembly process includes three aspects of work, namely, design, failure analysis and reliability testing. The process reliability departments of the industry's leading large electronics companies are also largely carried out in accordance with this framework. These three aspects of work can complete the requirements of assembly process reliability, from qualitative analysis to quantitative design. However, for most small and medium-sized electronics companies, it is difficult to build such a large system and organize a complete reliability department and design process. For them, it is more effective to establish their own electronic assembly process reliability specifications or guidelines to guide the steps to ensure reliability requirements during the PCB design phase, PCBA assembly process, process failure analysis, and process reliability testing, as well as when new processes emerge.