Welcome to pay attention to the "Investment Strategy" Baijia account to learn more about the new trends in the industry
1.ABF carrier board.
Shennan Circuit -- The mid-level products of FC-BGA packaging substrates have successfully completed the certification on the client, some of the mid-to-high-end products have entered the sample delivery stage, and the technology research and development of high-end products has successfully entered the middle and late stages, and the trial production capacity of high-end product samples has been preliminarily built.
Xingsen Technology Co., Ltd. -- is the leading IC substrate in China, and has built: 1) FC-CSP substrate production capacity of 350,000 square meters (including 20,000 square meters in Guangzhou factory and 1 in Zhuhai Xingke Phase I.)50,000 square meters), and it is planned that the second phase of Zhuhai Xingke production capacity (30,000 square meters) will be introduced after the first phase reaches production2) FC-BGA production capacity of 2 million pieces per month (Zhuhai factory), and invest 6 billion yuan to build a new Guangzhou factory (production capacity: 20 million pieces per month, built in two phases).
Huazheng New Materials -- CBF laminated insulating film can be used in the field of advanced packaging, such as FC-BGA, high-density packaging substrates and other key packaging materials.
2.Epoxy resin.
Huahai Chengke -- epoxy resin leader, products in the field of advanced packaging are in the layout stage, some products have achieved small batches, and some products are in the process of sample delivery and verification.
Feikai Materials -- A wholly-owned subsidiary, Dalui Technology, is the world's leading manufacturer of solder balls for high-end IC packaging such as BGA and CSP.
Kaihua Materials --The main products are epoxy powder encapsulating materials, epoxy plastic encapsulating materials, etc.
3.Electronic chemicals.
Tiancheng Technology Co., Ltd. -- engaged in the research and development, production and sales of special electronic chemicals required for PCB, IC substrate copper immersion and electroplating chemicals have passed the verification of core end customers.
Debang Technology - Underfill adhesive and other four chip-scale packaging materials are cooperating with a number of design companies and packaging and testing companies to promote verification, and TIM materials are actively promoting.
Strong New Materials -- The photosensitive polyimide (PSPI) produced is in the customer validation stage.
4.Mask.
Luwei Optoelectronics -- has been deeply involved in mask for many years, and its products cover the fields of flat panel display, semiconductor, PCB and touch, and have established long-term and stable cooperative relations with many well-known customers, including BOE, Huaxing Optoelectronics, Tianma Microelectronics, Jingfang Technology, Huatian Technology, Tongfu Microelectronics, etc.
Qingyi Optoelectronics Co., Ltd. plans to invest 3.5 billion yuan in the construction of Foshan production base project in Nanhai District, Foshan City, including the "high-precision mask production base construction project" and "high-end semiconductor mask production base construction project".
5.Encapsulation tape.
Cybrid Technology - Semiconductor encapsulation tapes are widely used in a variety of fields such as chip packaging, wafer handling, die bonding, and LED manufacturing.
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