In the wave of modern scientific and technological development, ultra-fine micro-hole machining has become a technology that has attracted much attention. Breakthroughs in this area are not only driving innovation in the manufacturing industry, but also showing great potential in multiple application areas. Next, let's take a look at what are the methods of ultra-fine microhole processing.
The common processing methods of ultra-fine microhole machining include:
Laser perforation technology: The use of high-energy laser beams to precisely irradiate materials to achieve the manufacture of tiny holes. Laser perforation technology is contactless and controllable during processing, and is suitable for a wide range of materials.
EDM: Electrical discharge by means of electrical pulse discharge, which generates tiny discharge holes on the surface of the workpiece, is suitable for hard materials and has a high degree of machining accuracy.
Chemical corrosion method: The chemical solution is used to corrode the surface of the material to form tiny through holes, but the environmental pollution is large, and the sewage treatment process is complicated.
Ion beam processing: The use of high-speed ion beams to process the surface of materials enables the fabrication of micron-level holes, which is widely used in the semiconductor industry.
The most suitable equipment for ultra-fine microhole processing:
Among these punching machines, the laser punch machine is the most advantageous processing equipment, which can punch holes in the micron range and has the highest accuracy of all equipment. The laser can achieve any irregular plane processing any hole shape, can achieve the best puncture, no deformation, no error, and a wide range of applications, almost any material can be processed, plus the equipment is fully automated processing, can cooperate with the assembly line production, can save labor costs, improve production efficiency, is currently the most popular punching equipment.