Continued from the first article and continued to write the second specification of PCB rigid-flex board.
Operating specification for PCB rigid-flex board (1).
ElevenStrip cleaning
Process flow
PuffinessDecoatingWashPicklingThree-stage washingDrying.
Defective items
Press-fit detection for silicone oil on the board surface causing delamination.
Job control
a. The decoating speed is 15m/min
XIILaminate L1 and L4 boards
Process flow
Positioning pins on the L1 layerUpper flex boardUpper L4 floorIron ironingTake the dowel pinExamine.
Defective items
Debris, lack of glue, misalignment.
Job control
a. Clean the incoming soft board and hard board.
b. Check whether the hard board is lacking glue.
c. Use 3The pins of 175 are first put on L1, and then the flex board is then L4
d. Check whether the four layers are stacked or not.
XIIIPressing
Process flow
Release filmPut the boardRelease filmPressing
Take the plateLeave to bake.
Defective items
Layered bubbles are not compacted and uneven.
Job control
a. Required to clean the fast press.
B. Pay attention to the pressing side, L1 side up, all plates face up with this side facing up.
c. Press-fit parameters: temperature 185 5 pressure 50-60kg, pre-pressure 20s, actual pressure 250-300s, do the first board inspection to see if there is any unreal pressure, steam drum, crushing, etc.
d.Baking takes 160 2h to bake
XIVTwo diamonds
Process flow
Open excipientsHit the dowelsUpper plateSchedulerAdjust the parametersDrillingDismantle the boardConversion order.
Defective items
Deviation less (more) holes Phi Feng large (small) holes burst holes Pressure pits.
Job control
a. Determine the data model of the MI indication relatively.
b. The number of packing boards can only be wrapped in one stack.
c. The parameters of drilling PTH hole drill cutter are reduced by 20% at the same time on the basis of the original entry and retraction
d. Drill the observation holes around the plate first, whether there is any deviation, and adjust the measured data.
XVGrinding plates
Process flow
Power onAdjust the parametersGrinding platesThree-stage washingDrying.
Defective items
Uneven grinding The grinding plate is excessive, and the grinding is not in place.
Job control
a. The speed is 3m min, and the power is 2000-2100
b. Grind the front and back sides once to check whether there is a borehole peak.
XVIHole decoating cleaning
Process flow
PuffinessDecoatingWashPicklingThree-stage washingDrying.
Defective items
Hole wall cleanliness.
Job control
a. The speed is 3m min, and the power is 2000-2100
b. Grind the front and back sides once to check whether there is a borehole peak.
XVIIPlasma
Process flow
General manufacturers outsourced.
Defective items
Not. Job control
a. The plate with the plasma coming back needs to be done within 8 hours.
XVIIIShen Tong
Process flow
Rack PI Adjustment Double Wash, Degreasing, Double Wash, Micro-etching, Water Washing, Pickling, Double Washing, Pre-prepreg, Activation
Double washing, accelerating, double washing, copper immersion, double washing, pickling, washing, drying, copper plating off the shelf.
Defective items
Poor backlight (no copper rotten holes) The board surface is black.
Job control
a. Do a good job of laboratory analysis of the medicine.
B. The PI adjuster was placed for 25 minutes, and the activation placement time was extended by 3 minutes in the original place, CTurn on the vibration and sink the copper twice, and make 2-3 backlights for each hanging.
XIXCopper plating
Process flow
Splint double wash, pickling copper plating, cyan washing lower plate.
Defective items
The copper thickness is uneven, the coating is fogged, the copper particles are burned, and the board surface is rough and flowery.
Job control
a. Do a good job of laboratory analysis of the medicine.
b. Copper plating current 15A time 50-60 minutes, c, do the first plate slice to see the copper plating of the hole layer, the thickness of the hole copper is more than 20mu.
XXGrinding plates
Process flow
Start-up adjustment parameters, grinding plate, three-stage deuterine washing, drying.
Defective items
Uneven grinding The grinding plate is excessive, and the grinding is not in place.
Job control
a. The speed is 3m min, and the power is 2000-2100
b. Grind the front and back sides once to check whether there are copper particles on the board surface.
XXIDry the film
Process flow
Check the dry film model, clean the press roller of the laminator, put the dry film, paste the dry film, and cut the film edge.
Clean the dry film crushed and transcribed.
Defective items
The film is wrinkled, the bubbles under the film, the garbage, the dry film is broken, and the adhesion of the film is not enough for the cleanliness of the clean room.
Job control
a. Before operation, clean the press wheel of the laminator with alcohol.
b. Select 30um Asahi Kacheng dry film operation, c. Pressure film parameter control temperature: 105 5 Pressure: 5-6kg Speed: 08-1.0m/min
d. After pressing the film, the excess dry film on the edge of the board must be cut clean to prevent the dry film from breaking.