Continued from the second article, continue to write PCB rigid-flex board operation specification three.
Operating specification for PCB rigid-flex board (1).
Operating specification for PCB rigid-flex board (2).
Two.
Ten. Two.
Process flow
Check the film, open the window tape, clean the film, align the lower plate.
Defective items
Film injury line alignment deviation garbage positioning Vacuum poor ** poor.
Job control
A. Check the corresponding model film used in MI indication.
b. The cleaning frequency of the film is cleaned once with a sticky dust roller every 1 exposure, cleaned with film water once every 5-7 exposures, checked once every 10 times exposed, and cleaned once every 5 exposures of the machine.
c. The ruler is controlled at 65-7.5 squares.
XXIIIDevelopment
Process flow
Tear off the protective film, develop 1, develop 2, supplement the development, wash in 3 stages, wash with water, dry and close the board.
Defective items
Incomplete development Excessive development and disconnection.
Job control
a. Use Na2CO3 weak alkaline solution for potion preparation, and the concentration is controlled at 09-1.2%
b. The thin wire side is facing down during development.
c. After development, the rework plate must be micro-etched, and then the film must be dried.
XXIVEtchingDecoating
Process flow
Put the board, etching one, etching two, etching three three sections washing.
Bulking, decoating, washing, pickling, three-stage washing, drying.
Defective items
Incomplete etching (under-etching) Excessive etching (thin lines).
The film is not exhausted, the dry film in the hole is printed, and the roller print.
Job control
a. Do a good test of the medicine before production.
b. Adjust the pressure to 2 during etching5-2.8kg cm speed 15-1.8m/min
c. The first piece of etching is confirmed, and the line width and line distance are inspected according to the tolerance indicated by MI.
XXVGrinding plates
Process flow
Start-up adjustment parameters, grinding plate, three-stage deuterine washing, drying.
Defective items
Uneven grinding The grinding plate is excessive, and the grinding is not in place.
Job control
a. The speed is 3m min, and the power is 2000-2100
b. Grind the front and back onceXXVISilk screen solder mask inks
Process flow
Drying the net, checking the net, setting the position, adjusting the ink, silk screen printing, pre-examination.
Defective items
The particles and inks are uneven, the sticky mesh and the plugged holes are not in place.
Job control
a. Use green oil according to 7:3 and add 3-5% boiling oil and stir for more than 20 minutes.
b. After the net is sealed, the screen table surface needs to be cleaned with a sticky dust wheel.
C. Use 43T screen plate to screen two knives to place the pig cage frame for 7 minutes 75
d. Screen printing two knives, stand still for 30 minutes, and pre-test for 35 minutes 75
e. Both sides are silk-screened using the above methods.
XXVIIPre-exam
Process flow
Open the oven, put the board, set the bake, take the plate and wait**.
Defective items
Excessive pre-baking Pre-baking is not in place.
Job control
a. Clean the oven before baking.
b. Use the pig cage rack to bake, in the way of silk screen printing, the first silk screen baking for 7 minutes 75 and the second silk screen baking for 35 minutes 75
XXVIII
Process flow
Check the film, open the window tape, clean the film, align the lower plate.
Defective items
Film scratch Parapoint deviation garbage film mark ** is not enough.
Job control
a. Use the MRAK point of the board surface as the alignment point.
b. Vacuum setting-59
c. The energy is set to 1100jm for the first development.
Twenty-nineDevelopment
Process flow
Put the board, develop 1, develop 2, supplement the development, wash in three stages, wash with water, dry and close the board.
Defective items
Improper development, excessive development, wheel printing.
Job control
a. Use Na2CO3 weak alkaline solution for potion preparation, and the concentration is controlled at 09-1.2% velocity is 25-3m/min
b. The first piece is tested with green copper to see if it is clean.
Three.
10. Baking. Process flow
Open the oven, put the board, set the bake, take the plate and wait**.
Defective items
Not enough baking. Job control
a. Clean the oven before baking.
b. Bake at 150 for 60 minutes.
c. After baking, use 3M glue to test whether the ink is off.
XXXXIImmersion gold
Process flow
Pre-treatment: Upper plate, degreasing, hot water washing, water washing, micro-etching, double water washing, pre-preglanding, activation, water washing, pickling, water washing, chemical nickel washing, chemical gold, * washing, washing, drying.
Defective items
Gold seepage, leakage plating, white gold surface, rough watermark, nickel gold, gold surface oxidation, oil off.
Job control
a. Analyze the control value of the potion before operation.
b. Use sandblasting before immersion gold, and do not use grinding plates to cause ink abrasion.
c. Control the time during the process operation to prevent the ink from falling off.
d. Control the thickness of gold and nickel according to IM instructions.